HMMC-2006 Agilent(Hewlett-Packard), HMMC-2006 Datasheet

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HMMC-2006

Manufacturer Part Number
HMMC-2006
Description
DC-6 GHz Unterminated SPDT Switch
Manufacturer
Agilent(Hewlett-Packard)
Datasheet
DC – 6 GHz Unterminated SPDT
Switch
Technical Data
Features
• Frequency Range: DC-6 GHz
• Insertion Loss:
• Isolation:
• Return Loss: >12 dB
• Switching Speed: <1 ns
• P
• Harmonics: <-25 dBc @
Description
The HMMC-2006 is a GaAs
monolithic microwave integrated
circuit (MMIC) designed for low
insertion loss and high isolation
from DC to 6 GHz. It is intended
for use as a general-purpose,
singlepole, double-throw (SPDT)
switch. One series and two shunt
MESFETs per throw provide
1.2 dB maximum insertion loss
and 35 dB minimum isolation at
6 GHz. HMMC-2006 chips use
through-substrate vias to provide
ground connections to the chip
backside and minimize the
number of wire bonds required.
The HMMC-2006 is also available
in an 8-lead flatpack (1GG7-4201).
5965-9071E
<1dB @ 6 GHz
>70 dB @ 45 MHz
>35 dB @ 6 GHz
(Both Input & Output)
23 dBm @ 50 MHz
>27dBm @ 6 GHz
20 dBm (DC coupled)
-1dB
:
Chip Size:
Chip Size Tolerance:
Chip Thickness:
Pad Dimensions:
Absolute Maximum Ratings
Note:
1. Operation in excess of any one of these conditions may result in permanent
Symbol
damage to this device. T
T
T
V
T
P
STG
max
sel
op
in
OUT2
RF
Parameters/Conditions
Select Voltages 1 and 2
RF Input Power
Operating Temperature
Storage Temperature
Maximum Assembly Temp.
(for 60 seconds max.)
7-20
960 x 1070 m (37.8 x 42.1 mils)
+0, -10 m (+0, -0.4 mils)
127
80 x 80 m (3.2 x 3.2 mils), or larger
A
= 25 C except for T
SEL1
15 m (5.0
RF
IN
[1]
HMMC-2006
SEL2
0.6 mils)
ch
Units
dBm
, T
V
C
C
C
STG
, and T
Min.
Chip ID
-12
-55
-65
max
OUT1
RF
.
Max.
+125
+165
+300
+ 3
30

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HMMC-2006 Summary of contents

Page 1

... MESFETs per throw provide 1.2 dB maximum insertion loss and 35 dB minimum isolation at 6 GHz. HMMC-2006 chips use through-substrate vias to provide ground connections to the chip backside and minimize the number of wire bonds required. The HMMC-2006 is also available in an 8-lead flatpack (1GG7-4201). 5965-9071E SEL1 RF OUT2 RF IN Chip Size: 960 x 1070 m (37 ...

Page 2

DC Specifications/Physical Properties, Symbol Parameters and Test Conditions I Leakage Current @ - Pinch-off Voltage @ Breakdown Voltage Total gss RF Specifications Symbol Parameters and Test Conditions ...

Page 3

... Applications The HMMC-2006 can be used in instrumentation, communica- tions, radar, ECM, EW, and many other systems requiring SPDT switching. It can be used for pulse modulation, port isolation, transfer switching, high-speed switching, replacement of me- chanical switches, and so on. It can also be used as a terminated SPST (single-pole-single-throw) ...

Page 4

... RF OUT Figure 1. HMMC-2006 Schematic. Recommended Operating Conditions, Select Line SEL1 SEL2 - - SEL2 SEL2 Path OUT1 RF OUT2 Isolated Low Loss Low Loss Isolated 7-23 RF OUT ...

Page 5

... HMMC-2006 Typical Performance -40 S 21-ON -50 -60 -70 - FREQUENCY (GHz) [1] Figure 2. Insertion Loss vs. Frequency. - -50 -60 -70 - FREQUENCY (GHz) Figure 5. Output-to-Output Isolation vs. Frequency. Notes: 1. Wafer-probed measurements 2. Calculated from wafer-probed measurements -14 - -22 22 -26 - FREQUENCY (GHz) Figure 3 ...

Page 6

... OUT2 0 0 Figure 6. HMMC-2006 Bonding Pad Locations. (Dimensions in micrometers) This data sheet contains a variety of typical and guaranteed performance data. The information supplied should not be interpreted as a complete list of circuit specifica- tions. In this data sheet the term typical refers to the 50th percentile performance. For additional information contact your local HP sales representative ...

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