K4H561638F Samsung semiconductor, K4H561638F Datasheet - Page 14

no-image

K4H561638F

Manufacturer Part Number
K4H561638F
Description
256Mb F-die DDR SDRAM Specification
Manufacturer
Samsung semiconductor
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
K4H561638F-GCB3
Manufacturer:
SAMSUNG
Quantity:
328
Part Number:
K4H561638F-TCA2
Manufacturer:
SAMSUNG
Quantity:
17
Part Number:
K4H561638F-TCB3
Manufacturer:
SAMSUNG
Quantity:
90
Part Number:
K4H561638F-TCB3
Manufacturer:
SAMSUNG
Quantity:
179
Part Number:
K4H561638F-TCB3T00
Manufacturer:
SAM
Quantity:
20 000
Part Number:
K4H561638F-TCBO
Manufacturer:
SAMSUNG
Quantity:
5
Part Number:
K4H561638F-UCB3
Manufacturer:
SEC
Quantity:
1 000
Part Number:
K4H561638F-UCB3
Manufacturer:
SAMSUNG
Quantity:
1 000
Company:
Part Number:
K4H561638F-UCB3
Quantity:
3 000
Company:
Part Number:
K4H561638F-UCB3
Quantity:
3 000
Company:
Part Number:
K4H561638F-UCCC
Quantity:
10
DDR SDRAM 256Mb F-die (x8, x16)
Maximum peak amplitude allowed for overshoot
Maximum peak amplitude allowed for undershoot
The area between the overshoot signal and VDD must be less than or equal to
The area between the undershoot signal and GND must be less than or equal to
Overshoot/Undershoot specification for Data, Strobe, and Mask Pins
DQ/DM/DQS AC overshoot/Undershoot Definition
-1
-2
-3
-4
-5
5
4
3
2
1
0
Maximum Amplitude = 1.2V
0 0.5 1.0 1.42 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 5.68 6.0 6.5 7.0
Parameter
Area = 2.4V-ns
VDDQ
Overshoot
Tims(ns)
Maximum Amplitude = 1.2V
undershoot
GND
Rev. 1.3 October, 2004
DDR333
2.4 V-ns
2.4 V-ns
1.2 V
1.2 V
Specification
DDR SDRAM
DDR200/266
2.4 V-ns
2.4 V-ns
1.2 V
1.2 V

Related parts for K4H561638F