MC74ACT573DWG ON Semiconductor, MC74ACT573DWG Datasheet - Page 11

IC BUFF DVR TRI-ST OCTAL 20SOIC

MC74ACT573DWG

Manufacturer Part Number
MC74ACT573DWG
Description
IC BUFF DVR TRI-ST OCTAL 20SOIC
Manufacturer
ON Semiconductor
Series
74ACTr
Datasheet

Specifications of MC74ACT573DWG

Logic Type
D-Type Latch
Circuit
1:8
Output Type
Tri-State
Voltage - Supply
4.5 V ~ 5.5 V
Independent Circuits
1
Delay Time - Propagation
10ns
Current - Output High, Low
24mA, 24mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC74ACT573DWG
MC74ACT573DWGOS
e
20
1
0.13 (0.005)
Z
b
M
D
0.10 (0.004)
11
10
E
A
H
E
A
MC74AC573, MC74ACT573
1
20 PIN PLASTIC EIAJ PACKAGE
PACKAGE DIMENSIONS
VIEW P
http://onsemi.com
CASE 967−01
SOEIAJ−20
M SUFFIX
ISSUE O
M
_
L
E
11
L
DETAIL P
Q
1
c
NOTES:
1.
2.
3.
4.
5.
Y14.5M, 1982.
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
A
b
D
E
L
L
M
Q
Z
c
e
E
E
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE
TERMINAL NUMBERS ARE SHOWN FOR
THE LEAD WIDTH DIMENSION (b) DOES NOT
1
1
12.35
MILLIMETERS
MIN
0.05
0.35
0.18
5.10
7.40
0.50
0.70
1.10
−−−
−−−
0
1.27 BSC
_
12.80
MAX
10
2.05
0.20
0.50
0.27
5.45
8.20
0.85
1.50
0.90
0.81
_
0.002
0.014
0.007
0.486
0.201
0.291
0.020
0.043
0.028
MIN
−−−
−−−
0.050 BSC
0
INCHES
_
0.081
0.008
0.020
0.504
0.215
0.323
0.033
0.059
0.035
0.032
MAX
0.011
10
_

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