MC10H130FN ON Semiconductor, MC10H130FN Datasheet
MC10H130FN
Specifications of MC10H130FN
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MC10H130FN Summary of contents
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... EE Pin assignment is for Dual−in−Line Package. Figure 2. Pin Assignment *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 8 CDIP−16 ...
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Table 1. MAXIMUM RATINGS Symbol V Power Supply ( Input Voltage ( Output Current Continuous out Surge T Operating Temperature Range A T Storage Temperature Range stg Maximum ratings are ...
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... The outputs are latched on the ORDERING INFORMATION Device MC10H130FN MC10H130FNG MC10H130FNR2 MC10H130FNR2G MC10H130L MC10H130P MC10H130PG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ...
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Y BRK −L− −M− 0.007 (0.180) Z 0.007 (0.180 −T− J VIEW S G1 0.010 (0.250) T L− NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, ...
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... American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. ...