MT48H16M16LFBF-75IT:H Micron Semiconductor Products, MT48H16M16LFBF-75IT:H Datasheet

MT48H16M16LFBF-75IT:H

Manufacturer Part Number

MT48H16M16LFBF-75IT:H

Description

Manufacturer

Micron Semiconductor Products

Datasheet

1.MT48H8M32LFB5-75_ITG.pdf (86 pages)

Specifications of MT48H16M16LFBF-75IT:H

Pack_quantity

297

Comm_code

85423231

Lead_time

Eccn

EAR99

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MT48H16M16LFBF-75IT:H

Manufacturer:

MICRON

Quantity:

5 959

Current page: 1 of 86
Download datasheet (3Mb)

Mobile Low-Power SDR SDRAM

MT48H16M16LF – 4 Meg x 16 x 4 banks

MT48H8M32LF – 2 Meg x 32 x 4 banks

Features

• V

• Fully synchronous; all signals registered on positive

• Internal, pipelined operation; column address can

• Four internal banks for concurrent operation

• Programmable burst lengths: 1, 2, 4, 8, and continu-

• Auto precharge, includes concurrent auto precharge

• Auto refresh and self refresh modes

• LVTTL-compatible inputs and outputs

• On-chip temperature sensor to control self refresh

• Partial-array self refresh (PASR)

• Deep power-down (DPD)

• Selectable output drive strength (DS)

• 64ms refresh period

PDF: 09005aef834c13d2

256mb_mobile_sdram_y36n.pdf - Rev. J 09/10 EN

edge of system clock

be changed every clock cycle

ous

rate

DDQ

= 1.7–1.95V

Products and specifications discussed herein are subject to change by Micron without notice.

256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM

Table 1: Configuration Addressing

Table 2: Key Timing Parameters

Architecture

Number of banks

Bank address balls

Row address balls

Column address balls

Notes:

Options

• V

• Addressing

• Configuration

• Plastic “green” packages

• Timing – cycle time

• Operating temperature range

• Revision

Note:

Speed

Grade

– Standard addressing option

– 16 Meg x 16 (4 Meg x 16 x 4 banks)

– 8 Meg x 32 (2 Meg x 32 x 4 banks)

– 54-ball VFBGA (8mm x 9mm)

– 90-ball VFBGA (8mm x 13mm)

– 6ns @ CL = 3

– 7.5ns @ CL = 3

– Commercial (0˚C to +70˚C)

– Industrial (–40˚C to +85˚C)

-75

Micron Technology, Inc. reserves the right to change products or specifications without notice.

-6

1. Available only for x16 configuration.

2. Available only for x32 configuration.

1. CL = CAS (READ) latency

DDQ

: 1.8V/1.8V

Clock Rate (MHz)

CL = 2

104

16 Meg x 16

BA0, BA1

A[12:0]

CL = 3

A[8:0]

166

133

CL = 2

8.0ns

Access Time

8 Meg x 32

BA0, BA1

A[11:0]

Features

A[8:0]

Marking

16M16

CL = 3

8M32

None

5.0ns

5.4ns

-75

-6

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