HMMC-3108-BLK HP [Agilent(Hewlett-Packard)], HMMC-3108-BLK Datasheet - Page 5

• Manufacturer Part Number: HMMC-3108-BLK
• Description: DC-16 GHz Packaged Divide-by-8
• Manufacturer: HP [Agilent(Hewlett-Packard)]

Assembly Notes
Independent of the bias applied
to the package, the backside of
the package should always be
connected to both a good RF
ground plane and a good
thermal heat sinking region on
the PC–board to optimize
performance. For single–ended
output operation the unused RF
output lead should be
terminated into 50W to a contact
point at the V
RF ground through a dc blocking
capacitor.
Figure 2. Package & Dimensions
Figure 3. Assembly Diagram (Single-supply, Positive-bias Configuration shown)
5
IN
IN
5
7
CC
SOIC8 w/Backside GND
potential or to
By
poss
IN
IN
50
V
6
V cc
CC
50
A minimum RF and thermal PC
board contact area equal to or
greater than 2.67 x 1.65 mm
(0.105" x 0.065") with eight
0.020" diameter plated–wall
thermal vias is recommended.
MMIC ESD precautions,
handling considerations, die
attach and bonding methods are
critical factors in successful
GaAs MMIC performance and
reliability.
150p
V
4
V
V cc
8
V ee
CC
÷
EE
50
V
2
V cc
CC
Vpwr
sel
50
Agilent application note #54,
“GaAs MMIC ESD, Die Attach
and Bonding Guidelines”
provides basic information on
these subjects.
Moisture Sensitivity
Classification: Class 1, per
JESD22-A112-A.
Additional References:
PN #18, “HBT Prescaler
Evaluation Board.”
Notes:
-
-
-
-
OUT
OUT
y S
B
C
D
E
e
H
L
a
A
A
1
All dimensions in millimeters.
Refer to JEDEC Outline MS-012 for
additional tolerances.
Exposed heat slug area on pkg bottom =
2.67 x 1.65
Exposed heat sink on package bottom must
be soldered to PCB RF ground plane.
m
b
l o
M
. 1
0
. 0
. 0
. 4
. 3
. 5
. 0
° 0
0 .
3
Pin 1
5 3
3 3
9 1
0 8
0 4
0 8
0 8
n i
OUT
OUT
. 1
7 2
B
M
. 1
. 1
.
. 0
0 .
. 5
. 4
. 6
° 8
5 2
S
5 7
1 5
5 2
0 0
0 0
0 2
7 2
C
x a