ELCH06-BJ4J6Z10-N0 EVERLIGHT [Everlight Electronics Co., Ltd], ELCH06-BJ4J6Z10-N0 Datasheet

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... CHIN Series ELCH06-BJ4J6Z10-N0 REV Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 Received ■ MASS PRODUCTION □ PRELIMINARY □ CUSTOMER DESIGN DEVICE NO. : DHE-0001303 PAGE : 12 Revised record DESCRIPTION New spec 1.Change format 2.Change IV、CCT、VF BIN 3.Change Package Dimension RELEASE DATE 2010 ...

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... DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 CHIN Series ELCH06-BJ4J6Z10-N0 Features Small & compact package and with high efficiency Typical luminous flux: 200 lm @ 1000mA Typical color temperature: 6000 K@1000mA Optical efficiency@1000mA : 54 lm/W ESD protection up to 8KV Moisture Sensitivity Level (MSL) Class 1 Grouping parameter: total luminous flux, color coordinates. ...

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... DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Device Selection Guide Chip Materials InGaN Absolute Maximum Ratings (T Parameter DC Forward Current (mA) Peak Pulse Current (mA) ， (400ms : ON 3 600ms : OFF) ESD Resistance Reverse Voltage Junction Temperature Thermal Resistance(junction to case) Operating Temperature Storage Temperature Power Dissipation (Pulse Mode) ...

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... DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 JEDEC Moisture Sensitivity Level Time (hours) 1 unlimited Electro-Optical Characteristics (T Parameter Luminous Flux (1) Forward Voltage (2) (3) Correlated Color Temperature Note: 1. Luminous flux measurement tolerance: ±10% 2. Forward voltage measurement tolerance: ±0.1V 3. Electric and optical data is tested pulse condition ...

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... DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 White Bin Structure Notes ： 1. Color Bin (1) ： 4 550K 2. Color Bin (2) ： 5 057K 3. Color Bin (3) ： 5 770K White Bin Coordinate Bin 4550 5057 5770 Note: 1. Color coordinates measurement allowance : ±0.01 2. Color bins are defined at I =1000mA and 50ms pulse operation condition. ...

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... DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Typical Electro-Optical Characteristics Curves Relative Spectral Distribution, I =1000mA@50ms Typical Radiation Patterns 1.0 0.8 0.6 0.4 0.2 0.0 -90 -60 -30 2q (Degree) Degree Note: 1. 2θ is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. ...

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... DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Forward Voltage vs Forward Current, T =25 ℃ solder pad 4.2 3.9 3.6 3.3 3.0 2.7 2.4 2.1 0 250 500 750 Forward Current(mA@50ms) Luminous Flux vs Forward Current, T =25 ℃ solder pad 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 250 500 750 Forward Current(mA@50ms) Note: 1. All correlation data is tested under superior thermal management with 1.0x 1 Copyright © ...

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... DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Package Dimension 0 .05/ +0 0,5 Cathode pad 0,125 Note: 1. Dimensions are in millimeters. 2. Tolerances unless mentioned are ± 0.1mm. 8 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 0.3 Optical center 2,04 Chip position Top view 0,25 1,1 Optical center Anode pad 1,64 www ...

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... DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Moisture Resistant Packing Materials Label Explanation Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel Progress Direction Polarity Note: 1. Dimensions are in millimeters. 2. Tolerances unless mentioned are ± 0.1mm. 9 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 ‧ ...

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... DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Reel Dimensions Note: 1. Dimensions are in millimeters. Moisture Resistant Packing Process 10 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 www.everlight.com ...

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... DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 Reflow Soldering Characteristics Soldering and Handling 1. Over-current-proof Though Chin series has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shift may cause enormous current shift and burn out failure would happen 2 ...

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... DATASHEET CHIN Series ELCH06-BJ4J6Z10-N0 4.2 For Reflow Process i. Lead reflow soldering temperature profile ii. Reflow soldering should not be done more than two times. iii. While soldering, do not put stress on the LEDs during heating. iv. After soldering, do not warp the circuit board. 12 Copyright © 2010, Everlight All Rights Reserved. Release Date : 10.06.2011. Issue No: DHE-0001303 ...