SE2521A60-EK1 SIGE [SiGe Semiconductor, Inc.], SE2521A60-EK1 Datasheet - Page 13

• Manufacturer Part Number: SE2521A60-EK1
• Manufacturer: SIGE [SiGe Semiconductor, Inc.]

Package Information
Figure 17 shows the detailed device package diagram. The pads on the SiGe RF modules are plated with gold over
nickel, with a gold thickness of approx. 0.75 to 1.0 um. The modules can be reflowed onto FR4 based material using
eutectic Pb based or common tin based Pb free solder pastes.
Package Handling Information
Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly. The SE2521A60 is capable of
withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or
in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that
the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For
details on both attachment techniques, precautions, and handling procedures recommended by SiGe, please refer to:
177-DST-01 Rev 1.4 Apr-04-2006
SiGe’s Application Note: “Land Grid Array Module Solder Reflow & Rework Information”, Document Number 69-
APP-01.
SiGe’s Application Note: “Handling, Packing, Shipping and Use of Moisture Sensitive LGA”, Document Number
69-APP-02.
10
11
12
6
7
8
9
GND
GND
GND
GND
GND
GND
13
5
GND
GND
GND
14
4
NOTES :
TOP SIDE
GND
GND
15
3
GND
GND
16
2
GND
GND
GND
GND
GND
GND
17
1
Figure 17: SE2521A60 Package Diagram
24
23
22
21
20
19
18
Confidential
RangeCharger™ 2.4 GHz Wireless LAN Front End
QA040406
SIGNAL PAD
DETAIL
24
23
22
21
20
19
18
GND
GND
GND
GND
GND
GND
17
1
GND
GND
16
2
BOTTOM SIDE
GND
GND
15
3
GND
GND
GND
14
4
GND
GND
GND
GND
GND
GND
13
SE2521A60
5
10
11
12
6
7
8
9
13 of 16
GROUND PAD
DETAIL