ML401 WJCI [WJ Communication. Inc.], ML401 Datasheet - Page 4

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ML401

Manufacturer Part Number
ML401
Description
1.7-2.2 GHz High IP3 Mixer with Integrated LO Amp
Manufacturer
WJCI [WJ Communication. Inc.]
Datasheet

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Quantity
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1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the
4. All dimensions are in millimeters (inches). Angles are in degrees.
5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and construction.
7. Use 1 oz. Copper minimum.
Thermal Specifications
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
Parameter
Operating Case Temperature
Thermal Resistance, Rth
and have a final plated thru diameter of .25 mm (.010”).
heatsink.
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
Mounting Configuration / Land Pattern
ML401
1.7–2.2 GHz High IP3 Mixer with Integrated LO Amp
(maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Rating
-40 to +85 °C
104 °C / W
ML401-G Mechanical Information
The Communications Edge
Specifications and information are subject to change without notice
The component will be lasermarked with a
“ML401-G”
alphanumeric lot code on the top surface of the
package.
Tape and reel specifications for this part will be
located on the website in the “Application
Notes” section.
ESD Rating: Class 1B
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 2 at +260 °C convection reflow
Standard:
ESD / MSL Information
Functional Pin Layout
Backside paddle is RF and DC ground.
GND
Vcc2
Vcc1
LO
Product Marking
1
2
3
4
Passes
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020
Pin
1
2
3
4
5
6
7
8
product
The backside paddle is Ground.
Product Information
500V to <1000V
1000V
Function
GND
Vcc1
Vcc2
GND
GND
LO
RF
IF
label
Page 4 of 4 June 2006
8
7
6
5
with
TM
GND
GND
RF
IF
an

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