HI-1567CDM HOLTIC [Holt Integrated Circuits], HI-1567CDM Datasheet
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HI-1567CDM
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HI-1567CDM Summary of contents
Page 1
... CMOS / TTL data suitable for inputting to a Manchester decoder. Each receiver has a separate enable input which can be used to force the output of the receiver to a logic 0 (HI-1567) or logic 1 (HI-1568). To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to each coupling transformer ...
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... CMOS/TTL data at the RXA/B and output pins. Each set of receiver outputs can be independently forced TXA logic "0" (HI-1567) or logic “1” (HI-1568) by setting RXENA or RXENB low. BUSA MIL-STD-1553 BUS INTERFACE A direct coupled interface (see Figure 2) uses a 1:2 ...
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... RECEIVER RXA/B Receive Logic RXA/B Comparator RXENA/B TXA/B TXA/B BUSA/B - BUSA/B Vin (Line to Line) RXA/B RXA/B HI-1567, HI-1568 BUSA/B BUSA/B Input Filter Figure 1. Block Diagram TRANSMIT WAVEFORM - EXAMPLE PATTERN RECEIVE WAVEFORMS - EXAMPLE PATTERN HOLT INTEGRATED CIRCUITS 3 Data Bus Isolation Coupler Transformer ...
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... Supply Voltage -0 +5.5 V VDD....................................... 5V... ±5% 10 Vp-p Temperature Range +1.0 A Industrial Screening.........-40°C to +85°C Hi-Temp Screening........-55°C to +125°C 1.0 W Military Screening..........-55°C to +125°C 7mW/°C 275°C for 10 sec. NOTE: ratings or outside recommended operating 175°C conditions may cause permanent damage to the device. These are stress ratings only. Operation -65° ...
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... C 1 MHz sine wave OUT TEST CONDITIONS From input zero crossing to RXA/B or RXA/B From RXENA/B rising or falling edge to RXA/B or RXA/B TXA/B, TXA/B to BUSA/B, BUSA/B 35 ohm load 35 ohm load Inhibited output Active output 1:2.5 BUSA/B BUSA/B Isolation Transformer 2.5 Isolation Transformer RXENA/B ...
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... T 1.79:1 Coupling Isolation Transformer Transformer the printed circuit board for optimum thermal dissipation. The heat sink is electrically connected to the VDD supply of the chip and therefore must be isolated from all other signals. CONDITION Ø JA Heat sink 54°C/W unsoldered Heat sink 47°C/W ...
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... PIN PLASTIC ESOIC - WB HI-1567PSM 0 20 PIN PLASTIC ESOIC - WB HI-1567CDI 0 20 PIN CERAMIC SIDE BRAZED DIP HI-1567CDT 0 20 PIN CERAMIC SIDE BRAZED DIP HI-1567CDM 0 20 PIN CERAMIC SIDE BRAZED DIP HI-1567PCI 0 44 PIN CHIP SCALE PACKAGE HI-1567PCT 0 44 PIN CHIP SCALE PACKAGE HI-1568PSI ...
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PLASTIC SMALL OUTLINE (ESOIC (Wide Body, Thermally Enhanced) .5035 ± .0075 (12.789 ± .191) .4065 ± .0125 Top View (10.325 ± .318) .018 (.457) .050 TYP (1.27) 20-PIN CERAMIC SIDE-BRAZED DIP .050 TYP. (1.270 TYP.) .200 MAX. ...
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... PLASTIC CHIP-SCALE PACKAGE 7.00 ± .10 7.00 ± .10 0.90 ± .10 PACKAGE DIMENSIONS Heat sink stud on bottom of package. 5.65 ± .15 0.40 ± .05 0.2 typ HOLT INTEGRATED CIRCUITS 9 millimeters 5.65 ± .15 0.50 0.25 typ ...