HI-1575 HOLTIC [Holt Integrated Circuits], HI-1575 Datasheet - Page 10

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HI-1575

Manufacturer Part Number
HI-1575
Description
3.3V Dual Transceivers with Integrated Encoder / Decoders
Manufacturer
HOLTIC [Holt Integrated Circuits]
Datasheet
HEAT SINKING THE LEADLESS PLASTIC
CHIP CARRIER PACKAGE
The HI-1575PCI/T is packaged in a 40 pin leadless plastic
chip carrier (LPCC). This package has a metal heat sink
pad on its bottom surface, which should be soldered to
the printed circuit board for optimum thermal dissipation.
The package heat sink is electrically isolated and may be
soldered to any convenient power plane or ground plane.
Redundant "vias" between the exposed board surface
and buried power or ground plane will enhance thermal
conductivity.
35
W
(.5 Zo)
HI -1575 TRANSMITTER
(.75 Zo)
(.75 Zo)
52.5
52.5
FIGURE 13. TRANSFORMER COUPLED TEST CIRCUITS
W
W
BUSA/B
BUSA/B
Transformer
Coupling
HOLT INTEGRATED CIRCUITS
1.4:1
Transformer
Isolation
1:2.5
Point
HI-1575
“A ”
T
Transformer
10
Isolation
2.5:1
APPLICATIONS NOTE
Holt Applications Note AN-500 provides circuit design
notes regarding the use of Holt MIL-STD-1553 data
communications devices. Layout considerations, as well
as recommended interface and protection components
are included.
Point
“A ”
T
Transformer
Coupling
1:1.4
HI-1575 RECEIVER
(.75 Zo)
(.75 Zo)
52.5
52.5
W
W
35
W
(.5 Zo)

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