AT86RF401E ATMEL [ATMEL Corporation], AT86RF401E Datasheet - Page 50
AT86RF401E
Manufacturer Part Number
AT86RF401E
Description
Smart RF Wireless Data Microtransmitter
Manufacturer
ATMEL [ATMEL Corporation]
Datasheet
1.AT86RF401E.pdf
(52 pages)
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Package Drawing
20A2 – TSSO
50
Notes:
A
AT86RF401
R
1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation AC, for additional
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess
5. Dimension D and E1 to be determined at Datum Plane H.
E
2325 Orchard Parkway
San Jose, CA 95131
information.
not exceed 0.15 mm (0.006 in) per side.
0.25 mm (0.010 in) per side.
of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.
Minimum space between protrusion and adjacent lead is 0.07 mm.
E1
Side View
Top View
b
e
All devices are packaged on tape in reel; standard reel quantity is 2,500 pieces.
D
TITLE
20A2, 20-lead (4.4 x 6.5 mm Body), 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP)
A2
SYMBOL
D
E
E1
A
A2
b
e
L
L1
End View
6.40
4.30
0.80
0.19
0.45
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
–
6.40 BSC
0.65 BSC
L1
1.00 REF
NOM
6.50
4.40
1.00
0.60
L
–
–
DRAWING NO.
20A2
6.60
4.50
1.20
1.05
0.30
0.75
MAX
1424F–RKE–12/03
NOTE
2, 5
3, 5
6/3/02
4
REV.
C
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