EMIF06 ETC, EMIF06 Datasheet
EMIF06
Available stocks
Related parts for EMIF06
EMIF06 Summary of contents
Page 1
... Communication systems ■ MCU Boards ■ DESCRIPTION The EMIF06-10006F1 is a highly integrated devices designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF06 flip-chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV ...
Page 2
... EMIF06-10006F1 ABSOLUTE RATINGS (limiting values) Symbol Parameter and test conditions P DC power per resistance R P Total DC power per package T T Maximum junction temperature j T Operating temperature range op Storage temperature range T stg ELECTRICAL CHARACTERISTICS (T Symbol Parameter V Breakdown voltage BR I Leakage current @ V RM ...
Page 3
... Fig. 4: ESD response to IEC61000-4-2 (+15kV air discharge) on one input V(in) and one output V(out). Fig. 6: Line capacitance versus applied voltage for filter. 100 0.0 0.5 EMIF06-10006F1 Aplac 7.62 User: ST Microelectronics Aplac 7.62 User: ST Microelectronics i3_o2.s2p 1M 10M 100M 1G F=1MHz V =30mV osc T =25°C j 1.0 1.5 2 ...
Page 4
... EMIF06-10006F1 Aplac model Rbump Lbump Ii* Cbump Cz=41pF@0V Rsub Output of each cell Ii* = Input of each cell EMIF06-10006F1 model Aplac parameters 4/6 Rs=100 Lbump Rbump Cz=41pF@0V Rsub sub sub 100 aplacvar aplacvar aplacvar Lbump 20 m aplacvar Rbump 1.2 pF aplacvar Cbump 100 m aplacvar Rsub 100 m ...
Page 5
... MARKING Dot, ST logo xxx = marking yww = datecode (y = year ww = week) All dimensions in µm EMIF06-10006F1 F 1 Pitch = 500µm Bump = 315µm FLIP CHIP 650µm ± 65 400 545 ...
Page 6
... All dimensions in mm OTHER INFORMATION Ordering code Marking EMIF06-10006F1 FTT Note: More packing informations are available in the application note AN1235: ''Flip-Chip: Package description and recommandations for use'' Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use ...