MC14556BCPG ON Semiconductor, MC14556BCPG Datasheet - Page 5

• Manufacturer Part Number: MC14556BCPG
• Description: IC DCODER/DEMUX DUAL 1:4 16-DIP
• Manufacturer: ON Semiconductor
• Series: 1400r
• Type: Decoder/Demultiplexerr

Specifications of MC14556BCPG

• Circuit: 1 x 2:4
• Independent Circuits: 1
• Voltage Supply Source: Dual Supply
• Voltage - Supply: 3 V ~ 18 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Product: Decoders, Encoders, Multiplexers & Demultiplexers
• Logic Family: 4000B
• Supply Voltage (max): 18 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Mounting Style: Through Hole
• Circuit Type: Low-Power Schottky
• Current, Supply: 600 μA
• Function Type: 2-Channels
• Logic Function: Decoder/Demultiplexer
• Logic Type: CMOS
• Number Of Circuits: Dual
• Package Type: PDIP-16
• Special Features: Binary
• Temperature, Operating, Range: -55 to +125 °C
• Voltage, Supply: 3 to 18 VDC
• No. Of Outputs: 4
• Supply Voltage Range: 3V To 18V
• Logic Case Style: DIP
• No. Of Pins: 16
• Operating Temperature Range: -55°C To +125°C
• Filter Terminals: DIP
• Rohs Compliant: Yes
• Family Type: 4000 CMOS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC14556BCPG; MC14556BCPGOS

e
16
1
16
1
0.13 (0.005)
H
Z
b
−A−
G
D
M
F
D
9
8
16 PL
9
8
0.25 (0.010)
B
S
A
E
0.10 (0.004)
A
H
1
E
K
C
M
−T−
VIEW P
T
A
SEATING
PLANE
PACKAGE DIMENSIONS
M
M
_
L
http://onsemi.com
E
J
CASE 648−08
CASE 966−01
SOEIAJ−16
PDIP−16
ISSUE A
ISSUE T
L
DETAIL P
5
L
Q
M
1
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
NOTES:
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
G
M
A
B
C
D
F
H
J
K
L
S
1.
2.
3.
4.
5.
Y14.5M, 1982.
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
M
A
b
c
D
E
e
L
L
Q
Z
E
1
E
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE
TERMINAL NUMBERS ARE SHOWN FOR
THE LEAD WIDTH DIMENSION (b) DOES NOT
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
1
0.110
MIN
0.100 BSC
0.050 BSC
0
INCHES
_
MILLIMETERS
MIN
0.05
0.35
0.10
9.90
5.10
7.40
0.50
0.70
1.10
---
---
0
1.27 BSC
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
0.70
10
10.50
MAX
10
2.05
0.20
0.50
0.20
5.45
8.20
0.85
1.50
0.90
0.78
_
_
MILLIMETERS
18.80
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
0.002
0.014
0.007
0.390
0.201
0.291
0.020
0.043
0.028
2.54 BSC
1.27 BSC
0
MIN
---
---
0
0.050 BSC
_
INCHES
_
19.55
MAX
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
0.081
0.008
0.020
0.413
0.215
0.323
0.033
0.059
0.035
0.031
10
MAX
0.011
10
_
_