AUIRFU1010Z International Rectifier Corp., AUIRFU1010Z Datasheet

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AUIRFU1010Z

Manufacturer Part Number
AUIRFU1010Z
Description
IPAKAUTOMOTIVE MOSFET 55V,91A, 7.5 MOHM, 63 NC QG, IPAK
Manufacturer
International Rectifier Corp.
Datasheet

Specifications of AUIRFU1010Z

Lead_time
84
Pack_quantity
75
Comm_code
85412900
Eccn
EAR99
Features
Description
Specifically designed for Automotive applications,
this HEXFET
processing techniques to achieve extremely low
on-resistance per silicon area. Additional features
of this design
temperature, fast switching speed and improved
repetitive avalanche rating . These features com-
bine to make this design an extremely efficient and
reliable device for use in Automotive applications
and a wide variety of other applications.
HEXFET
*Qualification standards can be found at http://www.irf.com/
www.irf.com
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (T
I
I
I
I
P
V
E
E
I
E
T
T
Thermal Resistance
R
R
R
D
D
D
DM
AR
J
STG
D
GS
AS
AS
AR
JC
JA
JA
@ T
@ T
@ T
Advanced Process Technology
Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
@T
(tested )
C
C
C
C
®
= 25°C Continuous Drain Current, V
= 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited)
= 25°C Continuous Drain Current, V
= 25°C Power Dissipation
is a registered trademark of International Rectifier.
®
Power MOSFET utilizes the latest
are a 175°C junction operating
Pulsed Drain Current
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case )
Junction-to-Case
Junction-to-Ambient (PCB mount)
Junction-to-Ambient
A
) is 25°C, unless otherwise specified.
j
Ã
AUTOMOTIVE GRADE
Parameter
Parameter
GS
GS
g
@ 10V (Silicon Limited)
@ 10V (Package Limited)
i
G
h
Gate
G
d
AUIRFR1010Z
S
D
HEXFET
AUIRFR1010Z
V
R
I
I
See Fig.12a, 12b, 15, 16
D (Silicon Limited)
D (Package Limited)
DSS
DS(on)
Typ.
D-Pak
–––
–––
–––
Drain
D
-55 to + 175
Max.
®
360
140
± 20
110
220
300
0.9
91
65
42
typ.
max.
Power MOSFET
Max.
1.11
110
40
Source
PD - 97683
5.8m
7.5m
S
42A
55V
91A
Units
Units
W/°C
°C/W
mJ
mJ
°C
W
A
V
A
1

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