MAAP-000080-DIE000 MACOM [Tyco Electronics], MAAP-000080-DIE000 Datasheet - Page 6

• Manufacturer Part Number: MAAP-000080-DIE000
• Description: Amplifier, Power, 1 W 2-18 GHz
• Manufacturer: MACOM [Tyco Electronics]

6
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Amplifier, Power, 1 W
2-18 GHz
Mechanical Information
Chip Size: 3.150 x 3.150 x 0.075 mm
Bond Pad Dimensions
124.02
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
24.63
0.00
IN
RF In and Out
Chip edge to bond pad dimensions are shown to the center of the bond pad (mils).
Pad
Figure 1. Die Layout
(
124 x 124 x 3 mils)
Size (μm)
100 x 200
200 x 150
150 x 150
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Visit www.macom.com for additional data sheets and product information.
Size (mils)
MAAP-000080-DIE000
4 x 8
8 x 6
6 x 6
84.96
OUT
Preliminary Datasheet
Rev -