MAAPGM0018-DIE MACOM [Tyco Electronics], MAAPGM0018-DIE Datasheet - Page 5

• Manufacturer Part Number: MAAPGM0018-DIE
• Description: 2W Ku-Band Power Amplifier 12.0-15.5 GHz
• Manufacturer: MACOM [Tyco Electronics]

Specifications subject to change without notice.
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Email: [e-mail]
2W Ku-Band Power Amplifier
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Europe: Tel. [phone], Fax[phone]
Asia/Pacific: Tel.[phone], Fax [phone]
Figure 5. Die Layout
Bond Pad Dimensions
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
3.380mm.
3.228mm.
1.690mm.
0.152mm.
Mechanical Information
Chip Size: 4.404 x 3.380 x 0.075 mm
RF In and Out
Pad
0
0
Chip edge to bond pad dimensions are shown to the center of the bond
V
V
GG
GG
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V
V
D1, 2
D1, 2
Size (µm)
100 x 200
200 x 150
150 x 150
V
V
GG
GG
(
173 x 133 x 3 mils)
MAAPGM0018-DIE
V
V
D3
D3
Size (mils)
4 x 8
8 x 6
6 x 6
0.162mm.
3.218mm.
1.690mm.
V 1.00