MAAPGM0026-DIE MACOM [Tyco Electronics], MAAPGM0026-DIE Datasheet - Page 4

• Manufacturer Part Number: MAAPGM0026-DIE
• Description: Amplifier, Power, 0.6W 1.5-3.3 GHz
• Manufacturer: MACOM [Tyco Electronics]

4
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Amplifier, Power, 0.6W
1.5-3.3 GHz
Mechanical Information
Chip Size: 2.980 x 1.580 x 0.075 mm
Bond Pad Dimensions
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
1.580mm.
1.378mm.
0.840mm.
0.202mm.
RF In and Out
Pad
0
0
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Figure 5. Die Layout
(
117 x 62 x 3 mils)
Size (μm)
100 x 200
200 x 150
150 x 150
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Visit www.macom.com for additional data sheets and product information.
Size (mils)
4 x 8
8 x 6
6 x 6
MAAPGM0026-DIE
Preliminary Information
0.840mm.
903185 —