MAAPGM0030-DIE MACOM [Tyco Electronics], MAAPGM0030-DIE Datasheet - Page 6

• Manufacturer Part Number: MAAPGM0030-DIE
• Description: 5.0-9.0 GHz 1W Power Amplifier
• Manufacturer: MACOM [Tyco Electronics]

Specifications subject to change without notice.
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5.0-9.0 GHz 1W Power Amplifier
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Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V
damage to amplifier.
Figure 6. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW testing.
RF
IN
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100 pF
V
GG
DD
before applying positive bias to V
100 pF
V
GG
0.1 µF
0.1 µF
V
RF
DD
OUT
MAAPGM0030-DIE
V
GG
DD
to prevent