MAAPGM0046-DIE MACOM [Tyco Electronics], MAAPGM0046-DIE Datasheet
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MAAPGM0046-DIE
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MAAPGM0046-DIE Summary of contents
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... Point-to-Point Communications ♦ Ku Satellite Communications Description The MAAPGM0046-Die is a 3-stage 400mW power amplifier with on- chip bias networks. This product is fully matched to 50 ohms on both the input and output. It can be used as a power amplifier stage driver stage in high power applications. ...
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... DISS STG Symbol -1 desired voltage, typically 8 set I , (approximately @ –1.8 V). DQ MAAPGM0046-DIE Absolute Maximum 17.0 +12.0 -3.0 660 5.1 180 -55 to +150 Min Typ Max 4.0 8.0 10.0 -2.3 -2.0 -1.5 12.0 15.0 150 Note Units dBm ° ...
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... North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 Visit www.macom.com for additional data sheets and product information. 15.5 16.0 16.5 Frequency (GHz) and P = 12dBm Drain Voltage (V) MAAPGM0046-DIE 28 POUT PAE 17.0 17.5 18 ...
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... Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 Visit www.macom.com for additional data sheets and product information. 15.5 16.0 16.5 Frequency (GHz) Figure 3. 1dB Compression Point vs. Drain Voltage 15.5 16.0 16.5 Frequency (GHz) MAAPGM0046-DIE VDD = 4 VDD = 6 VDD = 8 VDD = 10 17.0 17.5 18.0 GAIN INPUT VSW R OUTPUT VSW R 17.0 17 ...
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... Visit www.macom.com for additional data sheets and product information. V GND:G GND:G GND:G IN GND:G GND:G GND:G 0 Figure 5. Die Layout Chip edge to bond pad dimensions are shown to the center of the bond pad. Pad DD GG MAAPGM0046-DIE 118 mils GND:G GND:G GND:G GND:G GND: G OUT GND:G V GND:G GND:G GG Size ( µ ...
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... Visit www.macom.com for additional data sheets and product information. 100 GND:G GND:G IN GND:G IN GND:G GND:G GND 100 pF 150 Ω 0.1 µF before applying positive bias MAAPGM0046-DIE V DD 0.1 µF GND:G GND:G GND:G GND:G GND:G RF OUT OUT GND:G GND:G GND prevent ...