MAAPGM0057-DIE MACOM [Tyco Electronics], MAAPGM0057-DIE Datasheet - Page 5

• Manufacturer Part Number: MAAPGM0057-DIE
• Description: 2.0-13.0 GHz 1.2 W Power Amplifier
• Manufacturer: MACOM [Tyco Electronics]

5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
2.0-13.0 GHz 1.2 W Power Amplifier
Bond Pad Dimensions
Drain Supply Voltage V
Gate Supply Voltage V
Gate Supply Voltage V
Mechanical Information
Chip Size: 4.46 x 4.46 x 0.075 mm
RF In and Out
Pad
4.246mm.
2.230mm.
0.214mm.
0
Chip edge to bond pad dimensions are shown to the center of the bond pad.
0
GT
GB
DD
GND :G
GND:G
IN
GND:G
GND:G
GND: G
GND: G
GND: G
GND: G
GND: G
GND: G
Figure 12. Die Layout
GND: G
GND: G
GND: G
GND: G
GND: G
GND: G
GND: G
GND: G
GN D:G
GN D:G
GN D:G
GN D:G
Size (μm)
100 x 150
100 x 100
150 x 150
150 x 150
VG_B
VD
V
V
GB
D
GN D:G
GN D:G
GN D:G
GN D:G
GND :G
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GND: G
(
176 x 176 x 3 mils)
GN D:G
GN D:G
GN D:G
GN D:G
GN D:G
GN D:G
GND: G
GND: G
GND: G
GND: G
GND: G
GND: G
GND:G
GND:G
V G_T
GND :G
GND:G
GND:G
GND:G
OUT
V
GT
4.461mm.
4.284mm.
2.230mm.
Size (mils)
4 x 6
4 x 4
6 x 6
6 x 6
MAAPGM0057-DIE
Preliminary Information
RO-P-DS-3089 A