MAAPGM0068-DIE MACOM [Tyco Electronics], MAAPGM0068-DIE Datasheet
MAAPGM0068-DIE
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MAAPGM0068-DIE Summary of contents
Page 1
... Symbol Typical 5.7-8 OUT 31 P1dB PAE VSWR 1.4:1 2.1:1 VSWR 38 TOI 35 IMD3 470 I DD MAAPGM0068-DIE Rev B Preliminary Datasheet 6, 7, and 8 GHz Bands Mechanical Sample (Die) MAAP-000068-MCH000 2 = 300 Ω = 320 dBm Units GHz dBm dBm dB % dBm dBc mA mA ...
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... Symbol Min Θ Power Derating Curve, Quiescent (No RF off last. GG MAAPGM0068-DIE Rev B Preliminary Datasheet Units 13 dBm +12.0 V -3.0 V 520 mA 5.2 W 170 °C °C Typ Max Unit 8.0 10.0 V -2.0 -1.2 V 8.0 11.0 dBm 28.0 °C/W Note 5 °C ...
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... Input VSWR Output VSWR 9.0 9.5 10.0 10 Figure 6. Output Power, Small Signal Gain, Power Added Efficiency, and Drain Current vs. Junction Temperature at 8V, 7.5 GHz, and 25% IDSS MAAPGM0068-DIE Rev B Preliminary Datasheet 6V 8V 10V 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 Frequency (GHz) -20ºC 25ºC 75ºC 6.0 6.5 7.0 7.5 8.0 8.5 9 ...
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... GHz 7 GHz 21 8 GHz 9 GHz 19 6 GHz 7 GHz 17 8 GHz Figure 12. Gain vs. Output Power and Frequency at 8V and 25% IDSS MAAPGM0068-DIE Rev B Preliminary Datasheet Output Power (dBm) 6 GHz 7 GHz 8 GHz 9 GHz - ...
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... Figure 16. Third Order Intermod vs. Output Power and Frequency at 6V. 100 GHz 7 GHz 10 8 GHz Figure 18. Third Order Intermod vs. Output Power and Frequency at 8V. MAAPGM0068-DIE Rev B Preliminary Datasheet 6 GHz 7 GHz 8 GHz 9 GHz - Input Power (dBm) 6 GHz 7 GHz 8 GHz 5 7 ...
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... GHz 20 7 GHz 8 GHz -20 -15 -10 -5 Figure 22. Third Order Intermod vs. Temperature and Frequency MAAPGM0068-DIE Rev B Preliminary Datasheet 6 GHz 7 GHz 8 GHz Fundamental Output Power per Tone (dBm) 6 GHz 7 GHz 8 GHz ...
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... Chip edge to bond pad dimensions are shown to the center of the bond pad. Bond Pad Dimensions Pad RF In and Out DC Drain Supply Voltage VDD DC Gate Supply Voltage VGG 78 x 124 x 3 mils) ( Figure 23. Die Layout Size (μm) 100 x 200 200 x 150 150 x 150 MAAPGM0068-DIE Rev B Preliminary Datasheet Size (mils ...
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... For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply negative bias to V damage to amplifier GND 100- 200 100- 200 pF before applying positive bias MAAPGM0068-DIE Rev B Preliminary Datasheet 0.01-0.1μF RF OUT to prevent DD ...