K4H560438E-TC/LA2 SAMSUNG [Samsung semiconductor], K4H560438E-TC/LA2 Datasheet - Page 22

• Manufacturer Part Number: K4H560438E-TC/LA2
• Description: DDR SDRAM 256Mb E-die (x4, x8)
• Manufacturer: SAMSUNG [Samsung semiconductor]

DDR SDRAM 256Mb E-die (x4, x8)
Voltage
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
(V)
Typical
12.2
18.1
24.1
29.8
34.6
39.4
43.7
47.5
51.3
54.1
56.2
57.9
59.3
60.1
60.5
61.0
61.5
62.0
62.5
62.9
63.3
63.8
64.1
64.6
64.8
65.0
Low
6.0
Pulldown Current (mA)
Typical
100.9
101.9
102.8
103.8
104.6
105.4
High
13.5
20.1
26.6
33.0
39.1
44.2
49.8
55.2
60.3
65.2
69.9
74.2
78.4
82.3
85.9
89.1
92.2
95.3
97.2
99.1
6.8
Table 8. Full Strength Driver Characteristics
Minimum
13.8
18.4
23.0
27.7
32.2
36.8
39.6
42.6
44.8
46.2
47.1
47.4
47.7
48.0
49.4
49.6
49.8
49.9
50.0
50.2
50.4
50.5
48.4
48.9
49.1
4.6
9.2
Maximum
103.8
108.4
112.1
115.9
119.6
123.3
126.5
129.5
132.4
135.0
137.3
139.2
140.8
18.2
26.0
33.9
41.8
49.4
56.8
63.2
69.9
76.3
82.5
88.3
93.8
99.1
9.6
Typical
-12.2
-18.1
-24.0
-29.8
-34.3
-38.1
-41.1
-41.8
-46.0
-47.8
-49.2
-50.0
-50.5
-50.7
-51.0
-51.1
-51.3
-51.5
-51.6
-51.8
-52.0
-52.2
-52.3
-52.5
-52.7
-52.8
Low
-6.1
Typical
-101.3
-107.1
-124.0
-129.3
-134.6
-139.9
-145.2
-150.5
-155.3
-160.1
pullup Current (mA)
-112.4
-118.7
-14.5
-21.2
-27.7
-34.1
-40.5
-46.9
-53.1
-59.4
-65.5
-71.6
-95.5
-77.6
-83.6
-89.7
High
-7.6
Rev. 1.3 April. 2005
Minimum
-13.8
-18.4
-23.0
-27.7
-32.2
-36.0
-38.2
-38.7
-39.0
-39.2
-39.4
-39.6
-39.9
-40.1
-40.2
-40.3
-40.4
-40.5
-40.6
-40.7
-40.8
-40.9
-41.0
-41.1
-41.2
DDR SDRAM
-4.6
-9.2
Maximum
-100.6
-108.1
-123.0
-130.4
-136.7
-144.2
-150.5
-156.9
-163.2
-169.6
-176.0
-181.3
-187.6
-192.9
-198.2
-115.5
-10.0
-20.0
-29.8
-38.8
-46.8
-54.4
-61.8
-69.5
-77.3
-85.2
-93.0