EDI8L24129V10BC WEDC [White Electronic Designs Corporation], EDI8L24129V10BC Datasheet

EDI8L24129V10BC

Manufacturer Part Number

EDI8L24129V10BC

Description

128Kx24 SRAM 3.3 Volt

Manufacturer

WEDC [White Electronic Designs Corporation]

Datasheet

1.EDI8L24129V10BC.pdf (8 pages)

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128Kx24 SRAM 3.3 Volt

FEATURES

White Electronic Designs Corp. reserves the right to change products or speciﬁ cations without notice.

March 2005

Rev. 5

128Kx24 bit CMOS Static

Random Access Memory Array

• Fast Access Times: 10, 12, and 15ns

• Master Output Enable and Write Control

• TTL Compatible Inputs and Outputs

• Fully Static, No Clocks

Surface Mount Package

• 119 Lead BGA (JEDEC MO-163), No. 391

• Small Footprint, 14mm x 22mm

• Multiple Ground Pins for Maximum

Noise Immunity

Single +3.3V (±5%) Supply Operation

DSP Memory Solution

Motorola DSP5630xTM

Analog Devices SHARCTM

I/012

I/013

I/014

I/015

I/016

I/017

I/018

I/019

I/020

I/021

I/022

I/023

PIN CONFIGURATION

GND

A13

White Electronic Designs

GND

A10

A14

GND

VCC

GND

A15

A11

GND

A12

A16

I/010

I/011

I/00

I/01

I/02

I/03

I/04

I/05

I/06

I/07

I/08

I/09

DESCRIPTION

The EDI8L24129VxxBC is a 3.3V, three megabit SRAM

constructed with three 128Kx8 die mounted on a multi-

layer laminate substrate. With 10 to 15ns access times,

x24 width and a 3.3V operating voltage, the EDI8L24129V

is ideal for creating a single chip memory solution for the

Motorola DSP5630x (Figure 3) or a two chip solution for

the Analog Devices SHARCTM DSP (Figure 4).

The single or dual chip memory solutions offer improved

system performance by reducing the length of board traces

and the number of board connections compared to using

multiple monolithic devices. For example, the capacitance

load on the data lines for the BGA package is 58% less

than a monolithic SOJ solution.

The JEDEC Standard 119 lead BGA provides a 44% space

savings over using 128Kx8, 300mil wide SOJs and the BGA

package has a maximum height of 100 mils compared to

148 mils for the SOJ packages. The BGA package also

allows the use of the same manufacturing and inspection

techniques as the Motorola DSP, which is also in a BGA

package.

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

DQØ-DQ23

AØ-A16

GND

PIN NAMES

Address Inputs

Chip Enable

Master Write Enable

Master Output Enable

Common Data Input/Output

Power (3.3V±5%)

Ground

No Connection

EDI8L24129V

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