LIS3L06AL_06 STMICROELECTRONICS [STMicroelectronics], LIS3L06AL_06 Datasheet - Page 15

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LIS3L06AL_06

Manufacturer Part Number
LIS3L06AL_06
Description
MEMS INERTIAL SENSOR-3-axis - +/-2g/6g ultracompact linear accelerometer
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
LIS3L06AL
6
Package Information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 20. LGA-8 Mechanical Data & Package Dimensions
DIM.
SOLDER MASK
OPENING
A1
A2
A3
D1
E1
M1
N1
N2
P1
P2
L1
T1
T2
M
N
R
L
h
k
j
DETAIL A
1.460
0.180
4.850
4.850
0.875
1.300
0.740
0.615
1.200
MIN.
B
(4x)
j
A
K
C
1.520
0.220
5.000
5.000
1.270
2.540
1.225
0.900
2.000
1.225
1.170
1.350
0.790
1.170
0.640
0.150
0.050
0.100
TYP.
A
mm
B
E
METAL PAD
MAX.
1.600 0.0574 0.0598 0.0629
1.330
0.260
5.150
5.150
0.925 0.0344 0.0354 0.0364
1.400 0.0511 0.0531 0.0551
0.840 0.0291 0.0311 0.033
0.665 0.0242 0.0251 0.0261
1.600 0.0472
E1
P1
0.007 0.0086 0.0102
0.190 0.1968 0.2027
0.190 0.1968 0.2027
MIN.
D
K E
0.0482
0.0787
0.0482
0.0059
0.0019
0.0039
0.046
0.046
TYP.
inch
0.05
0.1
h
C
0.0523
0.0629
MAX.
A
B
seating plane
A3
A1
A2
R
Land Grid Array Package
K
K
C
MECHANICAL DATA
LGA8 (5x5x1.6mm)
OUTLINE AND
Detail A
T1
E
6
5
7
M
Package Information
8
4
M1
1
2
3
7669231 C
D
®
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