KMM5324000BSW SAMSUNG [Samsung semiconductor], KMM5324000BSW Datasheet - Page 18

Manufacturer Part Number

KMM5324000BSW

Description

4M x 32 DRAM SIMM Using 4Mx16, 4K Refresh, 5V

Manufacturer

SAMSUNG [Samsung semiconductor]

Datasheet

1.KMM5324000BSW.pdf (18 pages)

DRAM MODULE

PACKAGE DIMENSIONS

1.000(31.75)

.250(6.35)

.080(2.03)

.250(6.35)

.133(3.38)

.010(.25)MAX

Gold/Solder Plating Lead

.050(1.27)

Tolerances : .005(.13) unless otherwise specified

NOTE : The used device is 4Mx16 DRAM, TSOPII

DRAM Part No. : KMM5324000BSW/BSWG -- KM416C4100BS

R.062(1.57)

.250(6.35)

.041 .004(1.04 .10)

( Front view )

4.250(107.95)

3.984(101.19)

( Back view )

3.750(95.25)

.125 DIA .002(3.18 .051)

R.062 .004(R1.57 .10)

.054(1.37)

.047(1.19)

KMM5324000BSW/BSWG

.100(2.54)

0.125 MIN

(3.20MIN)

MAX

Units : Inches (millimeters)

.400(10.16)