AAT2550_08 ANALOGICTECH [Advanced Analogic Technologies], AAT2550_08 Datasheet - Page 34

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AAT2550_08

Manufacturer Part Number
AAT2550_08
Description
Total Power Solution for Portable Applications
Manufacturer
ANALOGICTECH [Advanced Analogic Technologies]
Datasheet
1. The leadless package family, which includes QFN, TQFN, DFN, TDFN and STDFN, has exposed copper (unplated) at the end of the lead terminals due to the manufacturing
© Advanced Analogic Technologies, Inc.
AnalogicTech cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AnalogicTech product. No circuit patent licenses, copyrights, mask work rights, or other intellectual
property rights are implied. AnalogicTech reserves the right to make changes to their products or specifi cations or to discontinue any product or service without notice. Except as provided in AnalogicTech’s terms and
conditions of sale, AnalogicTech assumes no liability whatsoever, and AnalogicTech disclaims any express or implied warranty relating to the sale and/or use of AnalogicTech products including liability or warranties
relating to fi tness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. In order to minimize risks associated with the customer’s applications, adequate
design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. Testing and other quality control techniques are utilized to the extent AnalogicTech deems necessary to
support this warranty. Specifi c testing of all parameters of each device is not necessarily performed. AnalogicTech and the AnalogicTech logo are trademarks of Advanced Analogic Technologies Incorporated. All other
brand and product names appearing in this document are registered trademarks or trademarks of their respective holders.
Package Information
All dimensions in millimeters.
Advanced Analogic Technologies, Inc.
3230 Scott Boulevard, Santa Clara, CA 95054
Phone (408) 737-4600
Fax (408) 737-4611
34
34
SystemPower
SystemPower
process. A solder fillet at the exposed copper edge cannot be guaranteed and is not required to ensure a proper bottom solder connection.
TM
TM
Top View
Pin 1 Dot By Marking
4.000 ± 0.050
w w w . a n a l o g i c t e c h . c o m
w w w . a n a l o g i c t e c h . c o m
QFN44-24
Total Power Solution for Portable Applications
Total Power Solution for Portable Applications
18
13
0.305 ± 0.075
19
12
Bottom View
R0.030Max
Side View
2.7 ± 0.05
0.214 ± 0.036
24
7
1
6
Pin 1 Identification
PRODUCT DATASHEET
PRODUCT DATASHEET
AAT2550178
AAT2550178
2550.2008.02.1.3
2550.2008.02.1.3

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