W2465 WINBOND [Winbond], W2465 Datasheet - Page 8

• Manufacturer Part Number: W2465
• Description: 8K X 8 CMOS STATIC RAM
• Manufacturer: WINBOND [Winbond]

BONDING PAD DIAGRAM
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to V
A3
A4
A2
A1
6
5
8
7
A5
A0
4
9
A6
O0
10
3
O1
A7
11
2
Y
A12
12
O2
1
27S-2
13S-1
V
V
DD
SS
13S-2
V
SS
27S-1
V
14
03
DD
X
WE
O4
26
15
CS2
O5
16
25
O6
24
A8
17
23
O7
A9
18
A11
CS1
A10
22
21
OE
19
20
- 8 -
PAD NO.
13S-1
13S-2
27S-1
27S-2
10
11
12
14
15
16
17
18
19
20
21
22
23
24
25
26
1
2
3
4
5
6
7
8
9
DD
or left floating in the PCB layout.
-226.95
-350.95
-484.10
-608.10
-739.75
-741.75
-741.75
-741.75
-610.60
-481.50
-343.80
-206.10
193.30
332.40
465.60
603.30
738.15
740.15
740.15
738.15
606.50
482.50
349.35
225.35
-73.00
-50.40
60.10
94.20
-8.35
X
-1231.85
-1456.30
-1456.30
-1466.30
-1466.30
-1466.30
-1401.10
-1212.80
-1466.30
-1466.30
-1466.30
-1466.30
-1466.30
-1456.30
-1221.45
1526.15
1526.15
1526.15
1526.15
1526.15
1315.10
1310.80
1526.15
1526.15
1526.15
1526.15
1526.15
1526.15
1456.10
W2465
Y