EC1078_07 WJCI [WJ Communication. Inc.], EC1078_07 Datasheet - Page 4

• Manufacturer Part Number: EC1078_07
• Description: InGaP HBT Gain Block
• Manufacturer: WJCI [WJ Communication. Inc.]

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
EC1078
InGaP HBT Gain Block
(maximum 260°C reflow temperature) and leaded (maximum 245°C reflow temperature) soldering processes.
Outline Drawing
Land Pattern
EC1078B-G Mechanical Information
Rating
-40 to +85 °C
128 °C/W
Specifications and information are subject to change without notice
The component will be marked with an
“1078G” designator with an alphanumeric lot
code on the top surface of the package.
obsolete tin-lead package is marked with an
“1078”
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1A
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper performance of this
2. Add as much copper as possible to inner and outer layers near the
3. Mounting screws can be added near the part to fasten the board to a
4. Do not put solder mask on the backside of the PC board in the
5. RF trace width depends upon the PC board material and
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Mounting Config. Notes
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
part to ensure optimal thermal performance.
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
region where the board contacts the heatsink.
construction.
MSL / ESD Rating
Product Marking
designator
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
JEDEC Standard J-STD-020
followed
Page 4 of 4 April 2007
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