CXA1875 SONY [Sony Corporation], CXA1875 Datasheet - Page 10

no-image

CXA1875

Manufacturer Part Number
CXA1875
Description
8-bit D/A Converter Compatible with I2C Bus
Manufacturer
SONY [Sony Corporation]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CXA1875AM
Manufacturer:
SONY
Quantity:
1 000
Part Number:
CXA1875AM
Manufacturer:
SONY/索尼
Quantity:
20 000
Part Number:
CXA1875AM-T4
Manufacturer:
TOSH
Quantity:
2 844
Part Number:
CXA1875AM-T4
Manufacturer:
SONY
Quantity:
1 000
Part Number:
CXA1875AM-T4
Manufacturer:
SONY
Quantity:
1 000
Part Number:
CXA1875AM-T4
Manufacturer:
SONY/索尼
Quantity:
20 000
Part Number:
CXA1875M-T4
Manufacturer:
LS
Quantity:
3 823
Package Outline
Purchase of Sony’s I
system, provided that the system conforms to the I
CXA1875AM
CXA1875AP
Unit : mm
2
C components conveys a license under the Philips I
16
1
SONY CODE
EIAJ CODE
JEDEC CODE
SONY CODE
EIAJ CODE
JEDEC CODE
1.2 ± 0.15
0.5 ± 0.1
19.2 – 0.1
0.45 ± 0.1
16
1
+ 0.4
2.54
SOP-16P-L01
SOP016-P-0300
DIP-16P-01
DIP016-P-0300
Similar to MO-001-AE
9.9 – 0.1
9
8
2
+ 0.4
C Standard Specifications as defined by Philips.
16PIN SOP (PLASTIC)
16PIN DIP (PLASTIC)
9
—10—
8
1.27
PACKAGE STRUCTURE
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
0.24
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
M
2
C Patent Rights to use these components in an I
0.2 – 0.05
+ 0.1
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
1.0 g
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
0.2g
1.85 – 0.15
0.1 – 0.05
+ 0.2
+ 0.4
0.15
0° to 15°
CXA1875AP/AM
2
C

Related parts for CXA1875