EXC28BA121U PANASONIC [Panasonic Semiconductor], EXC28BA121U Datasheet - Page 4

• Manufacturer Part Number: EXC28BA121U
• Description: Chip Bead Array
• Manufacturer: PANASONIC [Panasonic Semiconductor]

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Recommendations and precautions are described below.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
● Never touch this product with the tip of a soldering iron.
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog.
1. When possible, do not mount Chip Bead Array (hereafter called the bead arrays) by fl ow soldering. It is highly
2. Use rosin-based fl ux or halogen-free fl ux.
3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
4. Do not apply shock to the bead arrays or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies
5. Store the bead arrays in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to
6. Use the bead arrays within half a year after the date of the out go ing inspection indicated on the packages.
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Recommended Land Pattern Design
Recommended Soldering Conditions
each electrode for 3 seconds or less.
possible that fl ow soldering may cause bridges between the electrodes.
in advance.
may be chipped, affecting their performance. Excessive mechanical stress may damage the bead arrays. Handle
with care.
60 %, where there are no rapid changes in temperature or humidity.
● Recommended soldering conditions for refl ow
Safety Precautions
· Refl ow soldering shall be performed a maximum of
· Please contact us for additional information when
· Please measure the temperature of the terminals
two times.
used in conditions other than those specifi ed.
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Preheating
E
F
Peak
Time
E
B
F
E
Heating
F
E
For soldering (Example : Sn-37Pb)
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Preheating
Main heating
Peak
Preheating
Main heating
Peak
140 °C to 160 °C
150 °C to 170 °C
Dimension (mm)
C
D
A
B
E
F
Above 200 °C
Above 230 °C
Temperature
Temperature
max. 260 °C
235 ± 10 °C
1.75
0.25
0.25
1.4
0.4
0.5
Chip Bead Array
60 s to 120 s
60 s to 120 s
30 s to 40 s
30 s to 40 s
max. 10 s
max. 10 s
Time
Time
Jul. 2008