EMIF02-AV01F3_10 STMICROELECTRONICS [STMicroelectronics], EMIF02-AV01F3_10 Datasheet

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EMIF02-AV01F3_10

Manufacturer Part Number
EMIF02-AV01F3_10
Description
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Features
Complies with the following standards
Application
Description
The EMIF02-AV01F3 is a highly integrated array
designed to suppress EMI / RFI noise and provide
impedance matching for mobile phones and
portable applications.
The EMIF02-AV01F3 is in Flip-Chip package to
offer space saving and high RF performance.
Additionally, this low-pass filter includes an ESD
protection circuitry to prevent damage to the
application when subjected to ESD surges up
to 15 kV.
April 2010
High-density capacitor
EMI low-pass filter and ESD protection
High-efficiency in EMI filtering
Lead-free package
400 µm pitch
Very small PCB footprint: 0.77 mm x 1.17 mm
Very thin package: 0.605 mm
High reliability offered by monolithic integration
Reduction of parasitic elements thanks to CSP
integration
IEC 61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
IEC 61000-4-2 level 1 on internal pin (A1, C1)
– 2 kV (air discharge)
– 2 kV (contact discharge)
Dual audio and video line interface protection
and filtering in mobile phones
Dual audio and video line IPAD™, EMI filter and ESD protection
on
external pin (A2, C2)
Doc ID 12835 Rev 4
Figure 1.
Figure 2.
TM: IPAD is a trademark of STMicroelectronics.
Gnd
B2
A1
C1
2 kV
Pin configuration (bump side
view)
Schematic
2 kV
EMIF02-AV01F3
1
Flip Chip
5 bumps
R
R
15 kV
15 kV
2
A
B
C
C
C
C2
www.st.com
A2
1/7
7

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EMIF02-AV01F3_10 Summary of contents

Page 1

... Application ■ Dual audio and video line interface protection and filtering in mobile phones Description The EMIF02-AV01F3 is a highly integrated array designed to suppress EMI / RFI noise and provide impedance matching for mobile phones and portable applications. The EMIF02-AV01F3 is in Flip-Chip package to offer space saving and high RF performance. ...

Page 2

... R I line line 2 °C) amb Parameter Parameter Breakdown voltage Leakage current @ V RM Stand-off voltage Line capacitance Test conditions = 30 mV 100 kHz osc Doc ID 12835 Rev 4 EMIF02-AV01F3 Value 125 200 - 150 ...

Page 3

... EMIF02-AV01F3 Figure 4. Attenuation simulation with 1 kΩ input and 10 kΩ ouput db 0 -10 -20 -30 -40 Input -50 Output simulation -60 -70 -80 10 100 1k 10k 100k Figure 6. Digital crosstalk A1-A2 line C1 C1-C2 line C2 Figure 8. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one input (V ) and one output (V IN Figure 5 ...

Page 4

... ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. Figure 11. Package dimensions 4/7 400 µm ± 40 255 µm ± 40 185 µm 770 µm ± 30 µm Doc ID 12835 Rev 4 EMIF02-AV01F3 EMIF 605 µm ± 55 ® ...

Page 5

... EMIF02-AV01F3 Figure 12. Footprint Copper pad Diameter: 220 µm recommended 260 µm maximum Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended Figure 14. Flip Chip tape and reel specification Dot identifying Pin A1 location 0.69 ± 0.05 Note: Note: More information is available in the application note: AN2348:" ...

Page 6

... Document revision history Date 06-Oct-2006 11-Oct-2006 17-Apr-2008 08-Apr-2010 6/7 Revision 1 Initial release. 2 Corrected test conditions for C Updated ECOPACK statement. Updated 3 Figure 14. Reformatted to current standards. 4 Updated dimensions on page 1 and Doc ID 12835 Rev 4 EMIF02-AV01F3 Changes in Table 2. line Figure 10, Figure 11 and Figure 4, Figure 11, Figure 14. ...

Page 7

... EMIF02-AV01F3 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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