EMIF03-SIM02F2_08 STMICROELECTRONICS [STMicroelectronics], EMIF03-SIM02F2_08 Datasheet
EMIF03-SIM02F2_08
Related parts for EMIF03-SIM02F2_08
EMIF03-SIM02F2_08 Summary of contents
Page 1
... SIM Interface (Subscriber Identify Module) ■ UIM Interface (Universal Identify Module) Description The EMIF03-SIM02F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference.The EMIF03 Flip Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15kV ...
Page 2
... Tolerance ± 20 Tolerance ± 20 line 2 °C) amb Parameter and test conditions = 25 °C) amb Parameters RM Test conditions EMIF03-SIM02F2 Value 125 -40 to +85 -55 to 150 ...
Page 3
... Vexternal : 10V/d Vinternal : 10V/d 100ns/d Characteristics S21 (dB) attenuation measurement (B1-B3 line) EMIF03-SIM02F2_FREQ-MEAS_PM428 Aplac 7.70 User: ST Microelectronics Sep 22 2004 0.00 dB 100.0k 1.0M 10.0M 100.0M f/Hz B1/B3 line Analog crosstalk measurements EMIF03-SIM02F2_FREQ-MEAS_PM428 Aplac 7.70 User: ST Microelectronics Sep 22 2004 0.00 dB 100.0k 1.0M 10.0M 100.0M f/Hz Xtalk A2/B3 Voltages when IEC61000-4-2 (-15 kV air discharge) applied to external pin Vexternal : 5V/d Vinternal : 5V/d 1.0G 1.0G ...
Page 4
... Rgnd Model Dint1 Model Dext1 BV=15 BV=15 CJO=Cint1 CJO=Cext1 IBV=1u IBV=1u IKF=1000 IKF=1000 IS=10f IS=10f ISR=100p ISR=100p N=1 N=1 M=0.3333 M=0.3333 RS=0.001m RS=0.001m VJ=0.6 VJ=0.6 TT=50n TT=50n EMIF03-SIM02F2 Rbump Lbump a3 Rsub Cbump bulk Rbump Lbump b1 Rsub Cbump bulk Rbump Lbump c3 Dint1 bulk Rsub Cbump Dint2 0.29 0.31 0.29 100m ...
Page 5
... EMIF03-SIM02F2 3 Ordering information scheme Figure 12. Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 10(pF letters = application 2 digits = version Package F = Flip Chip lead-free pitch = 500 µm, bump = 315 µm 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK packages ...
Page 6
... Ordering information Table 3. Ordering information Order code EMIF03-SIM02F2 6/8 Figure 15. Marking Dot identifying Pin A1 location 0.73 ± 0.05 All dimensions in mm Marking Package GJ Flip Chip EMIF03-SIM02F2 Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week Ø 1.5 ± 0.1 4 ± 0.1 1.52 4 ± 0.1 User direction of unreeling ...
Page 7
... EMIF03-SIM02F2 6 Revision history Table 4. Document revision history Date 08-Oct-2004 20-Oct-2004 25-Mar-2005 13-Jun-2005 12-Sep-2005 24-Apr-2008 Revision 1 First issue. 2 Minor layout update. Figure 1 on page 1: pin configuration definitions changed from RST 3 out, CLK out and Data out to RST ext, CLK ext and Data ext. ...
Page 8
... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF03-SIM02F2 ...