ERJ6GEYOC PANASONIC [Panasonic Semiconductor], ERJ6GEYOC Datasheet - Page 4

• Manufacturer Part Number: ERJ6GEYOC
• Description: Thick Film Chip Resistors
• Manufacturer: PANASONIC [Panasonic Semiconductor]

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In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount
properly. Generally, the land width should be 0.7 to 0.8 times the width of chip the resistor. In case of reflow soldering,
solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
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1. If transient load (heavy load in a short time) like pulse is to be applied, carry out an evaluation and
2. Chlorine type or other highly-reactive flux is not recommended. Residue could affect performance or reliability of
3. When using a soldering iron, never let the tip of the iron touch the body of the chip resistor. When using a
4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (pliers or tweezers) as it may
Design, Specifications are subject to change without notice.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
Recommended Land Pattern
Recommended Soldering Conditions
Recommendations and precautions are described below.
l Recommended soldering conditions for reflow
l Recommended soldering conditions for flow
confirmation test with the resistors actually mounted on the board.
When a load of more than the rated power is applied under load condition at steady state, it may
impair performance and/or reliability of the resistor.
Never exceed the specified rated power.
the resistors.
soldering iron with a tip at a high temperature, solder for as short time as possible (no more than three seconds
and up to 350 ¡C).
damage the protective coating of the resistor and may affect its performance.
Safety Precautions
áReflow soldering should be a maximum of two times
áPlease contact us for additional information when
áPlease measure the temperature of terminations and study
used in conditions other than those specified.
every type of printed circuit board for solderability, before
actual use.
Preheating
Soldering
140 ¡C to 160 ¡C
Temperature
245±5 ¡C
For soldering
Ask factory for technical specifications before purchase and/or use.
60 s to 120 s
20 s to 30 s
Time
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
ERJ1G(0201)
ERJ2G(0402)
ERJ3G(0603)
ERJ6G(0805)
ERJ8G(1206)
ERJ14(1210)
ERJ12(1812)
ERJ12Z(2010)
ERJ1T(2512)
Preheating
Main heating
Peak
Preheating
Main heating
Peak
(inches)
Type
150 ¡C to 180 ¡C
Temperature
max. 260 ¡C
0.3 to 0.4
0.5 to 0.6
0.7 to 0.9
3.3 to 3.7
1 to 1.4
2 to 2.4
2 to 2.4
3.6 to 4
5 to 5.4
140 ¡C to 160 ¡C
150 ¡C to 180 ¡C
Above 200 ¡C
Above 230 ¡C
Temperature
Temperature
max. 260 ¡C
235 ± 5 ¡C
For lead-free soldering
a
Thick Film Chip Resistors
Dimensions (mm)
0.8 to 0.9
1.4 to 1.6
3.2 to 3.8
5.7 to 6.5
7.6 to 8.6
2 to 2.2
4.4 to 5
4.4 to 5
6.2 to 7
b
60 s to 120 s
max. 10 s
60 s to 120 s
60 s to 120 s
30 s to 40 s
30 s to 40 s
max. 10 s
max. 10 s
Time
Time
Time
0.25 to 0.35
0.4 to 0.6
0.9 to 1.4
1.2 to 1.8
1.8 to 2.8
2.3 to 3.5
1.8 to 2.8
2.3 to 3.5
0.8 to 1
c