MASW-004100-1193_2 MA-COM [M/A-COM Technology Solutions, Inc.], MASW-004100-1193_2 Datasheet - Page 6

• Manufacturer Part Number: MASW-004100-1193_2
• Description: HMIC SP4T Silicon PIN Diode Switch
• Manufacturer: MA-COM [M/A-COM Technology Solutions, Inc.]

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ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
MASW-004100-1193
HMIC™ SP4T Silicon PIN Diode Switch
Cleanliness
The chip should be handled in a clean environment free of organic contamination.
Electro-Static Sensitivity
The MASW-004100-1193 PIN switch is ESD, Class 1A sensitive (HBM). The proper ESD handling procedures
must be used.
Wire Bonding
Thermosonic wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended. A
stage temperature of 150°C and a force of 18 to 22 grams should be used. Ultrasonic energy, if necessary, should
be adjusted to the minimum power required to achieve a good bond. RF wire and ribbon lengths should be kept
as short as possible to minimize parasitic inductance.
Mounting
These chips have Ti-Pt-Au back metal and can be mounted using 80Au/20Sn eutectic solder or electrically
conductive Ag epoxy. Mounting surface must be flat and clean of oils and contaminants.
Eutectic Die Attachment
An 80/20 gold-tin eutectic solder preform is recommended with a work surface temperature of 255°C and a tool
tip temperature of 265°C. When hot gas is applied, the tool tip temperature should be 290°C. The chip should
not be exposed to temperatures greater than 320°C for more than 10 seconds. No more than 3 seconds should
be required for the die attachment.
Silver Epoxy Die Attachment
thin epoxy fillet should be visible around the perimeter of the chip after placement to ensure complete coverage.
Cure epoxy per manufacturer’s recommended schedule. Typically +150°C for 1 hour.
A controlled thickness of no more than 2 mils is recommended for the best electrical and thermal conductivity. A
ASSEMBLY INSTRUCTIONS
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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Visit www.macomtech.com for additional data sheets and product information.
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