XR1007_0610 MIMIX [Mimix Broadband], XR1007_0610 Datasheet - Page 4

• Manufacturer Part Number: XR1007_0610
• Description: 11.0-17.0 GHz GaAs MMIC Receiver
• Manufacturer: MIMIX [Mimix Broadband]

11.0-17.0 GHz GaAs MMIC
Receiver
Mechanical Drawing
October 2006 - Rev 13-Oct-06
Vd1
Bias Arrangement
RF
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
Vg1,2
1
Bond Pad #1 (RF)
Bond Pad #2 (Vd1)
10
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
2
9
(0.079)
(0.064)
2.000
1.615
0.0
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
0.0
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.97 mg.
IF1
IF2
Tel: [phone] Fax: [phone] mimixbroadband.com
3
1
8
Bond Pad #3 (IF1)
Bond Pad #4 (Vd3)
4
7
(0.019)
0.481
their obligation to be compliant with U.S. Export Laws.
(Note: Engineering designator is 14REC0607)
10
6
Vg4
5
(0.035)
(0.035)
0.881
0.881
2
9
LO
Bond Pad #5 (LO)
Bond Pad #6 (Vg3)
Vd3
Vg3
(0.066)
(0.066)
1.681
1.681
3
8
Bond Pad #7 (Vg4)
Bond Pad #8 (IF2)
(0.082)
(0.082)
2.081
2.081
4
7
Bypass Capacitors - See App Note [2]
(0.090)
2.281
6
XR1007
5
(0.106)
2.700
Bond Pad #9 (Vg2)
Bond Pad #10 (Vg1)
(0.064)
1.625
R1007
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