MDT2520-CN AD [Analog Devices], MDT2520-CN Datasheet - Page 6

• Manufacturer Part Number: MDT2520-CN
• Description: Dual 3 MHz, 800 mA Buck
• Manufacturer: AD [Analog Devices]

ADP5023
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
AVIN to AGND
VIN1, VIN2 to AVIN
PGND1, PGND2 to AGND
VIN3, VOUT1, VOUT2, FB1, FB2, FB3,
VOUT3 to AGND
SW1 to PGND1
SW2 to PGND2
Storage Temperature Range
Operating Junction Temperature
Soldering Conditions
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
For detailed information on power dissipation, see the Power
Dissipation and Thermal Considerations section.
EN1, EN2, EN3, MODE to AGND
Range
Rating
−0.3 V to +6 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to (AVIN + 0.3 V)
−0.3 V to (VIN3 + 0.3 V)
−0.3 V to (VIN1 + 0.3 V)
−0.3 V to (VIN2 + 0.3 V)
−65°C to +150°C
−40°C to +125°C
JEDEC J-STD-020
Rev. A | Page 6 of 28
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
24-Lead, 0.5 mm pitch LFCSP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
35
JA
Data Sheet
θ
3
JC
Unit
°C/W