TSLG-XR8080-A08L-92-TR70 TAITRON [TAITRON Components Incorporated], TSLG-XR8080-A08L-92-TR70 Datasheet - Page 8

• Manufacturer Part Number: TSLG-XR8080-A08L-92-TR70
• Description: HIGH POWER LED
• Manufacturer: TAITRON [TAITRON Components Incorporated]

www.taitroncomponents.com
4. Assembly process flow
② Special thermal designs are also recommended to take in outer heat sink design, such as FR4
③ Sufficient thermal management must be conducted, or the die junction temperature will be over
PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc.
the limit under large electronic driving and LED lifetime will decrease critically.
Thermal conductive glue dispensing
Recommended material and its
supplier: EpoTek T7109 from Epoxy
Technology
LED emitter placement
Hot bar soldering of LED emitter
Note: The MCPCB should be preheated up to
40°C for increasing the solderability
Functional test of LED emitter
Curing of thermal conductive glue
TSLG-XR8080-A08L
High Power LED
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Rev. A/JY