UBA2211AP PHILIPS [NXP Semiconductors], UBA2211AP Datasheet - Page 16

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UBA2211AP

Manufacturer Part Number
UBA2211AP
Description
Half-bridge power IC family for CFL lamps
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet
NXP Semiconductors
Fig 10. Package outline SOT108-1 (SO14)
UBA2211
Product data sheet
SO14: plastic small outline package; 14 leads; body width 3.9 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT108-1
0.069
max.
1.75
A
0.010
0.004
0.25
0.10
A
14
1
1
Z
pin 1 index
y
0.057
0.049
1.45
1.25
A
2
076E06
IEC
0.25
0.01
e
A
3
0.019
0.014
0.49
0.36
b
p
D
0.0100
0.0075
All information provided in this document is subject to legal disclaimers.
0.25
0.19
MS-012
JEDEC
c
REFERENCES
0.35
0.34
8.75
8.55
D
(1)
Rev. 3 — 26 August 2011
0
0.16
0.15
E
4.0
3.8
b
(1)
p
8
7
JEITA
scale
1.27
0.05
2.5
e
w
M
c
0.244
0.228
H
6.2
5.8
E
A
2
0.041
5 mm
1.05
A
L
Half-bridge power IC family for CFL lamps
1
0.039
0.016
1.0
0.4
L
p
H
E
E
detail X
0.028
0.024
0.7
0.6
Q
PROJECTION
L
L
EUROPEAN
0.25
0.01
p
Q
v
(A )
3
A
0.25
0.01
w
θ
0.004
A
UBA2211
0.1
X
v
y
© NXP B.V. 2011. All rights reserved.
M
ISSUE DATE
99-12-27
03-02-19
A
0.028
0.012
Z
0.7
0.3
(1)
SOT108-1
θ
8
0
o
o
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