24LC128-I/SMG Microchip, 24LC128-I/SMG Datasheet - Page 18

• Manufacturer Part Number: 24LC128-I/SMG
• Description: ind, Semiconductors and Actives, EEPROMs, ser, Memory
• Manufacturer: Microchip

24AA128/24LC128/24FC128
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S)
DS21191N-page 18
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-113
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Lead Width
Lead Length
Tie Bar Width
Mold Draft Angle Top
A1
n
1
TOP VIEW
2
E1
E
Dimension Limits
Units
A2
A1
A3
E1
E2
D1
D2
A
E
D
B
R
D1
n
p
L
A2
D
A3
MIN
.000
.152
.085
.014
.020
A
.008 REF.
INCHES
.050 BSC
.194 BSC
.184 BSC
.236 BSC
.226 BSC
NOM
EXPOSED
.0004
.033
.026
.158
.091
.016
.024
.014
METAL
PADS
8
MAX
R
.039
.031
.002
.163
.097
.019
.030
12
B
BOTTOM VIEW
MIN
E2
0.00
3.85
2.16
0.35
0.50
© 2005 Microchip Technology Inc.
MILLIMETERS*
p
0.20 REF.
1.27 BSC
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
NOM
0.85
0.65
0.01
4.00
2.31
0.40
0.60
.356
PIN 1
L
8
ID
D2
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12