M24C16-WMN6TP/S STMicroelectronics, M24C16-WMN6TP/S Datasheet - Page 30

• Manufacturer Part Number: M24C16-WMN6TP/S
• Manufacturer: STMicroelectronics

Package mechanical data
30/40
Figure 15. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V
3. The circle in the top view of the package indicates the position of pin 1.
Table 21.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
Symbol
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
measuring.
ddd
A1
D2
E2
L1
L3
A
D
E
b
e
L
(2)
2 x 3 mm, outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
A
0.55
0.02
0.25
0.45
Typ
1.6
0.2
0.5
2
3
E
A1
millimeters
Doc ID 5067 Rev 13
0.45
0.08
Min
D
0.2
1.9
1.5
2.9
0.1
0.4
0.3
0
-
M24C16, M24C08, M24C04, M24C02, M24C01
Max
0.05
0.15
0.6
0.3
2.1
1.7
3.1
0.3
0.5
ddd
-
L3
0.0217
0.0008
0.0098
0.0787
0.1181
0.0079
0.0197
0.0177
0.063
Typ
D2
e
b
inches
0.0177
0.0079
0.0748
0.0591
0.1142
0.0039
0.0157
0.0118
0.08
UFDFPN-01
Min
SS
0
-
L1
E2
L
. It must not be
(1)
0.0236
0.0118
0.0827
0.0669
0.0118
0.0197
0.0059
0.002
0.122
Max
-