592D686X9010R2T Vishay Sprague, 592D686X9010R2T Datasheet - Page 11

• Manufacturer Part Number: 592D686X9010R2T
• Description: Single Components, Passive Components, Capacitors
• Manufacturer: Vishay Sprague

www.vishay.com
11
592D
Vishay Sprague
GUIDE TO APPLICATION (Continued)
3.1
3.2
4.
5.
6.
Case Code/Suffix
The sum of the peak AC voltage plus the applied DC
capacitor.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10% of the DC working voltage at + 25°C.
Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating or 1 volt maximum at
+ 25 °C and 5 % of the DC voltage rating or 0.5 volt
maximum at + 85 °C.
Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent Irms value be
established when calculating permissible operating
levels. (Power dissipation calculated using + 25 °C
temperature rise.)
voltage shall not exceed the DC voltage rating of the
Temperature
+ 125 °C
+ 25 °C
+ 85 °C
A/15H
B/15H
C/15H
D/15H
R/15H
B/20H
C/20H
D/20H
R/20H
X/20H
X/25H
Maximum Permissible Power
at + 25 °C (Watts) in Free Air
Derating Factor
For technical questions, contact: [e-mail]
Dissipation
0.125
0.175
0.175
0.180
0.06
0.08
0.10
0.15
0.08
0.11
0.14
Conformal Coated, Maximum CV
1.0
0.9
0.4
Solid Tantalum Chip Capacitors
TANTAMOUNT®, Low Profile,
7.
8.
8.1
8.2
Printed Circuit Board Materials: The capacitors are
compatible with most commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel). If your
desired board material is not shown there please
contact the Tantalum Marketing Department for
assistance in determining compatibility.
Attachment:
Solder Paste: The recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0 .025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
Soldering:
conventional soldering techniques, vapor phase,
convection, infrared reflow wave soldering and hot
plate methods. The Soldering Profile charts show
typical recomended time/temperature conditions for
soldering.
recommended maximum ramp rate is 2 °C per
second. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
Preheating
Capacitors
is
can
Document Number: 40004
recommended.
be
Revision: 03-May-05
attached
The
by