MC74HCT138AN ON Semiconductor, MC74HCT138AN Datasheet - Page 3

• Manufacturer Part Number: MC74HCT138AN
• Description: IC DECODER/DMUX 1-8 LSTTL 16DIP
• Manufacturer: ON Semiconductor
• Series: 74HCTr
• Type: Decoder/Demultiplexerr

Specifications of MC74HCT138AN

• Circuit: 1 x 3:8
• Independent Circuits: 1
• Current - Output High, Low: 4mA, 4mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: MC74HCT138ANOS

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
DC ELECTRICAL CHARACTERISTICS
Symbol
Symbol
V
Symbol
in
DI
V
V
V
V
V
T
t
I
I
V
I
V
P
V
T
, V
T
r
I
out
CC
I
CC
CC
out
stg
CC
, t
OH
OL
in
in
IH
CC
in
D
A
IL
L
f
out
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, V
Power Dissipation in Still Air
Storage Temperature
Lead Temperature, 1 mm from Case for 10 Seconds
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time (Figure 1)
Minimum High−Level Input
Voltage
Maximum Low−Level Input
Voltage
Minimum High−Level Output
Voltage
Maximum Low−Level Output
Voltage
Maximum Input Leakage Current
Maximum Quiescent Supply
Current (per Package)
Additional Quiescent Supply
Current
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
Parameter
(Plastic DIP, TSSOP or SOIC Package)
Parameter
Parameter
CC
and GND Pins
TSSOP Package†
(Voltages Referenced to GND)
SOIC Package†
V
|I
V
|I
V
|I
V
|I
V
|I
V
|I
V
V
I
V
V
l
out
out
out
out
out
out
out
out
out
out
in
in
in
in
in
in
in
in
Plastic DIP†
= V
= V
= V
= V
= V
= V
= 2.4 V, Any One Input
= V
= 0 mA
| v 20 mA
| v 20 mA
| v 20 mA
| v 4.0 mA
| v 20 mA
| v 4.0 mA
= 0 mA
= 0.1 V or V
= 0.1 V or V
IH
IH
IH
IH
CC
CC
CC
Test Conditions
http://onsemi.com
or V
or V
or V
or V
or GND
or GND
or GND, Other Inputs
IL
IL
IL
IL
CC
CC
– 0.5 to V
– 0.5 to V
3
– 55
Min
4.5
– 0.1 V
– 0.1 V
– 0.5 to + 7.0
– 65 to + 150
0
0
Value
± 20
± 25
± 50
750
500
450
260
CC
CC
+ 125
Max
V
500
5.5
+ 0.5
+ 0.5
CC
V
4.5
5.5
4.5
5.5
4.5
5.5
4.5
4.5
5.5
4.5
6.0
5.5
5.5
Unit
Unit
mW
V
mA
mA
mA
CC
_C
_C
_C
ns
V
V
V
V
V
≥ − 55_C
– 55 to
25_C
± 0.1
3.98
0.26
2.0
2.0
0.8
0.8
4.4
5.4
0.1
0.1
4.0
2.9
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, V
V
range GND v (V
tied to an appropriate logic voltage
level (e.g., either GND or V
Unused outputs must be left open.
out
This device contains protection
Unused inputs must always be
Guaranteed Limit
should be constrained to the
v 85_C
± 1.0
3.84
0.33
2.0
2.0
0.8
0.8
4.4
5.4
0.1
0.1
25_C to 125_C
40
2.4
in
v 125_C
or V
± 1.0
160
2.0
2.0
0.8
0.8
4.4
5.4
3.7
0.1
0.1
0.4
out
) v V
in
CC
CC
and
Unit
mA
mA
mA
V
V
V
V
.
).