MC10H115PG ON Semiconductor, MC10H115PG Datasheet - Page 5

• Manufacturer Part Number: MC10H115PG
• Description: IC RECEIVER QUAD LINE ECL 16DIP
• Manufacturer: ON Semiconductor
• Series: 10Hr

Specifications of MC10H115PG

• Number Of Drivers/receivers: *
• Protocol: *
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Operating Temperature: 0°C ~ 75°C
• Logic Type: Line Receiver
• Number Of Bits: *
• Logic Family: 10H
• Number Of Receivers: 4
• Receiver Signal Type: Differential
• Operating Supply Voltage: - 8 V to 0 V
• Maximum Operating Temperature: + 75 C
• Minimum Operating Temperature: 0 C
• Mounting Style: Through Hole
• Supply Voltage Range: -4.94V To -5.46V
• Filter Terminals: DIP
• Driver Case Style: DIP
• No. Of Pins: 16
• Operating Temperature Range: 0°C To +75°C
• Rohs Compliant: Yes
• Family Type: ECL
• Input Type: ECL
• Leaded Process Compatible: Yes
• Logic Base Number: H115
• Logic Case Style: DIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Supply Voltage: -
• Lead Free Status / Rohs Status: Details
• Other names: MC10H115PGOS

e
C
16
1
0.13 (0.005)
K
N
B
B
Z
b
D
M
16
1
E
9
8
F
A
A
E
0.10 (0.004)
A
H
1
G
0.25 (0.010)
E
VIEW P
9
8
PACKAGE DIMENSIONS
M
16X
CERAMIC DIP PACKAGE
M
T
_
http://onsemi.com
L
D
A
E
A
T
CASE 620A−01
CASE 966−01
SOEIAJ−16
SEATING
PLANE
L SUFFIX
CDIP−16
ISSUE O
ISSUE A
L
DETAIL P
L
5
0.25 (0.010)
Q
1
c
16X
M
T
M
J
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. TERMINAL NUMBERS ARE SHOWN FOR
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
Y14.5M, 1982.
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
L
M
A
b
c
D
E
e
L
Q
Z
E
E
1
1
NOTES:
MILLIMETERS
MIN
0.05
0.35
0.10
9.90
5.10
7.40
0.50
0.70
1.10
−−−
−−−
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
5 THIS DRAWING REPLACES OBSOLETE
0
1.27 BSC
_
ASME Y14.5M, 1994.
FORMED PARALLEL.
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
CASE OUTLINE 620−10.
DIM
M
A
B
C
D
E
F
G
H
K
L
N
10.50
MAX
10
2.05
0.20
0.50
0.20
5.45
8.20
0.85
1.50
0.90
0.78
_
0.750
0.240
0.015
0.055
0.008
0.125
0.020
MIN
−−−
0.050 BSC
0.100 BSC
0.300 BSC
0
INCHES
_
0.002
0.014
0.007
0.390
0.201
0.291
0.020
0.043
0.028
MIN
−−−
−−−
0.050 BSC
0
INCHES
_
0.785
0.295
0.200
0.020
0.065
0.015
0.170
0.040
MAX
15
_
0.081
0.008
0.020
0.413
0.215
0.323
0.033
0.059
0.035
0.031
MAX
0.011
10
_
19.05
MILLIMETERS
MIN
6.10
0.39
1.40
0.21
3.18
0.51
−−−
1.27 BSC
2.54 BSC
7.62 BSC
0
_
19.93
MAX
7.49
5.08
0.50
1.65
0.38
4.31
1.01
15
_