MC10H115PG ON Semiconductor, MC10H115PG Datasheet - Page 5
![IC RECEIVER QUAD LINE ECL 16DIP](/photos/6/54/65493/16-dip_648_sml.jpg)
MC10H115PG
Manufacturer Part Number
MC10H115PG
Description
IC RECEIVER QUAD LINE ECL 16DIP
Manufacturer
ON Semiconductor
Series
10Hr
Datasheet
1.MC10H115MEL.pdf
(6 pages)
Specifications of MC10H115PG
Number Of Drivers/receivers
*
Protocol
*
Mounting Type
Through Hole
Package / Case
16-DIP (0.300", 7.62mm)
Operating Temperature
0°C ~ 75°C
Logic Type
Line Receiver
Number Of Bits
*
Logic Family
10H
Number Of Receivers
4
Receiver Signal Type
Differential
Operating Supply Voltage
- 8 V to 0 V
Maximum Operating Temperature
+ 75 C
Minimum Operating Temperature
0 C
Mounting Style
Through Hole
Supply Voltage Range
-4.94V To -5.46V
Filter Terminals
DIP
Driver Case Style
DIP
No. Of Pins
16
Operating Temperature Range
0°C To +75°C
Rohs Compliant
Yes
Family Type
ECL
Input Type
ECL
Leaded Process Compatible
Yes
Logic Base Number
H115
Logic Case Style
DIP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Supply Voltage
-
Lead Free Status / Rohs Status
Details
Other names
MC10H115PGOS
e
C
16
1
0.13 (0.005)
K
N
B
B
Z
b
D
M
16
1
E
9
8
F
A
A
E
0.10 (0.004)
A
H
1
G
0.25 (0.010)
E
VIEW P
9
8
PACKAGE DIMENSIONS
M
16X
CERAMIC DIP PACKAGE
M
T
_
http://onsemi.com
L
D
A
E
A
T
CASE 620A−01
CASE 966−01
SOEIAJ−16
SEATING
PLANE
L SUFFIX
CDIP−16
ISSUE O
ISSUE A
L
DETAIL P
L
5
0.25 (0.010)
Q
1
c
16X
M
T
M
J
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. TERMINAL NUMBERS ARE SHOWN FOR
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
Y14.5M, 1982.
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
L
M
A
b
c
D
E
e
L
Q
Z
E
E
1
1
NOTES:
MILLIMETERS
MIN
0.05
0.35
0.10
9.90
5.10
7.40
0.50
0.70
1.10
−−−
−−−
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
5 THIS DRAWING REPLACES OBSOLETE
0
1.27 BSC
_
ASME Y14.5M, 1994.
FORMED PARALLEL.
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
CASE OUTLINE 620−10.
DIM
M
A
B
C
D
E
F
G
H
K
L
N
10.50
MAX
10
2.05
0.20
0.50
0.20
5.45
8.20
0.85
1.50
0.90
0.78
_
0.750
0.240
0.015
0.055
0.008
0.125
0.020
MIN
−−−
0.050 BSC
0.100 BSC
0.300 BSC
0
INCHES
_
0.002
0.014
0.007
0.390
0.201
0.291
0.020
0.043
0.028
MIN
−−−
−−−
0.050 BSC
0
INCHES
_
0.785
0.295
0.200
0.020
0.065
0.015
0.170
0.040
MAX
15
_
0.081
0.008
0.020
0.413
0.215
0.323
0.033
0.059
0.035
0.031
MAX
0.011
10
_
19.05
MILLIMETERS
MIN
6.10
0.39
1.40
0.21
3.18
0.51
−−−
1.27 BSC
2.54 BSC
7.62 BSC
0
_
19.93
MAX
7.49
5.08
0.50
1.65
0.38
4.31
1.01
15
_