MC10H116DG ON Semiconductor, MC10H116DG Datasheet - Page 5

• Manufacturer Part Number: MC10H116DG
• Description: IC RECEIVER TRPL LINE ECL 16SOIC
• Manufacturer: ON Semiconductor
• Series: 10Hr

Specifications of MC10H116DG

• Number Of Drivers/receivers: *
• Protocol: *
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (3.9mm Width)
• Operating Temperature: 0°C ~ 75°C
• Logic Type: Line Receiver
• Number Of Bits: *
• Logic Family: 10H
• Supply Voltage (max): - 5.46 V
• Supply Voltage (min): - 4.94 V
• Maximum Operating Temperature: 75 C
• Mounting Style: SMD/SMT
• Maximum Power Dissipation: 85 mW
• Minimum Operating Temperature: 0 C
• Number Of Lines (input / Output): / /
• Supply Current: 21 mA
• Number Of Receivers: 3
• Number Of Transmitters: Not Required
• Number Of Transceivers: Not Required
• Receiver Signal Type: Differential
• Transmitter Signal Type: Not Required
• Single Supply Voltage (typ): -5.2V
• Single Supply Voltage (min): -4.94V
• Single Supply Voltage (max): -5.46V
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Power Supply Requirement: Single
• Operating Temp Range: 0C to 75C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: SOIC
• Supply Voltage Range: 4.94V To 5.46V
• Filter Terminals: SMD
• Driver Case Style: SOIC
• No. Of Pins: 16
• Operating Temperature Range: 0°C To +75°C
• Rohs Compliant: Yes
• Family Type: ECL
• Input Type: ECL/HSTL
• Leaded Process Compatible: Yes
• Logic Base Number: H116
• Logic Case Style: SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Supply Voltage: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC10H116DGOS

C
16
K
1
N
B
B
H
−A−
16
G
1
E
F
F
D
9
8
16 PL
A
0.25 (0.010)
B
S
G
0.25 (0.010)
K
C
M
−T−
9
8
T
M
16X
A
T
SEATING
PLANE
PACKAGE DIMENSIONS
M
CERAMIC DIP PACKAGE
D
PLASTIC DIP PACKAGE
A
T
A
http://onsemi.com
SEATING
PLANE
CASE 620A−01
J
CASE 648−08
L
L SUFFIX
P SUFFIX
CDIP−16
ISSUE O
PDIP−16
ISSUE R
5
0.25 (0.010)
L
M
16X
M
T
M
J
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
Y14.5M, 1982.
FORMED PARALLEL.
DIM
M
A
B
C
D
G
H
K
S
F
J
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
5 THIS DRAWING REPLACES OBSOLETE
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0.020
MIN
0.100 BSC
0.050 BSC
ASME Y14.5M, 1994.
FORMED PARALLEL.
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
CASE OUTLINE 620−10.
0
INCHES
DIM
_
A
B
C
D
G
H
K
M
N
E
F
L
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
0.70
0.750
0.240
0.015
0.055
0.008
0.125
0.020
10
MIN
−−−
0.050 BSC
0.100 BSC
0.300 BSC
_
0
INCHES
_
18.80
MILLIMETERS
MIN
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
0.785
0.295
0.200
0.020
0.065
0.015
0.170
0.040
MAX
2.54 BSC
1.27 BSC
0
15
_
_
19.55
MAX
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
19.05
10
MILLIMETERS
MIN
6.10
0.39
1.40
0.21
3.18
0.51
−−−
1.27 BSC
2.54 BSC
7.62 BSC
0
_
_
19.93
MAX
7.49
5.08
0.50
1.65
0.38
4.31
1.01
15
_