MC10H116L ON Semiconductor, MC10H116L Datasheet - Page 5

• Manufacturer Part Number: MC10H116L
• Description: IC LINE RCVR TRIPLE ECL 16-CDIP
• Manufacturer: ON Semiconductor
• Series: 10Hr

Specifications of MC10H116L

• Number Of Drivers/receivers: *
• Protocol: *
• Mounting Type: Through Hole
• Package / Case: 16-CDIP (0.300", 7.62mm)
• Operating Temperature: 0°C ~ 75°C
• Logic Type: Line Receiver
• Number Of Bits: *
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Supply Voltage: -

C
16
K
1
N
B
B
H
−A−
16
G
1
E
F
F
D
9
8
16 PL
A
0.25 (0.010)
B
S
G
0.25 (0.010)
K
C
M
−T−
9
8
T
M
16X
A
T
SEATING
PLANE
PACKAGE DIMENSIONS
M
CERAMIC DIP PACKAGE
D
PLASTIC DIP PACKAGE
A
T
A
http://onsemi.com
SEATING
PLANE
CASE 620A−01
J
CASE 648−08
L
L SUFFIX
P SUFFIX
CDIP−16
ISSUE O
PDIP−16
ISSUE R
5
0.25 (0.010)
L
M
16X
M
T
M
J
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
Y14.5M, 1982.
FORMED PARALLEL.
DIM
M
A
B
C
D
G
H
K
S
F
J
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
5 THIS DRAWING REPLACES OBSOLETE
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0.020
MIN
0.100 BSC
0.050 BSC
ASME Y14.5M, 1994.
FORMED PARALLEL.
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
CASE OUTLINE 620−10.
0
INCHES
DIM
_
A
B
C
D
G
H
K
M
N
E
F
L
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
0.70
0.750
0.240
0.015
0.055
0.008
0.125
0.020
10
MIN
−−−
0.050 BSC
0.100 BSC
0.300 BSC
_
0
INCHES
_
18.80
MILLIMETERS
MIN
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
0.785
0.295
0.200
0.020
0.065
0.015
0.170
0.040
MAX
2.54 BSC
1.27 BSC
0
15
_
_
19.55
MAX
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
19.05
10
MILLIMETERS
MIN
6.10
0.39
1.40
0.21
3.18
0.51
−−−
1.27 BSC
2.54 BSC
7.62 BSC
0
_
_
19.93
MAX
7.49
5.08
0.50
1.65
0.38
4.31
1.01
15
_