EFM32LG995F256 Energy Micro, EFM32LG995F256 Datasheet - Page 69

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EFM32LG995F256

Manufacturer Part Number
EFM32LG995F256
Description
ARM Microcontrollers - MCU 256KB FL 32KB RAM
Manufacturer
Energy Micro
Datasheet

Specifications of EFM32LG995F256

Rohs
yes
Core
ARM Cortex M3
Processor Series
Leopard Gecko (LG)
Data Bus Width
32 bit
Maximum Clock Frequency
48 MHz
Program Memory Size
256 KB
Data Ram Size
32 KB
On-chip Adc
Yes
Operating Supply Voltage
1.85 V to 3.8 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
BGA-120
Mounting Style
SMD/SMT
A/d Bit Size
12 bit
Interface Type
I2C, SPI, USB, UART
Number Of Programmable I/os
93
Program Memory Type
Flash

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EFM32LG995F256
Manufacturer:
Energy Micro
Quantity:
10 000
Part Number:
EFM32LG995F256-T
Manufacturer:
Energy Micro
Quantity:
10 000
Preliminary
...the world's most energy friendly microcontrollers
List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32LG995 Memory Map with largest RAM and Flash sizes ........................................................................ 9
3.1. Typical Low-Level Output Current, 2V Supply Voltage .................................................................................. 16
3.2. Typical High-Level Output Current, 2V Supply Voltage ................................................................................. 17
3.3. Typical Low-Level Output Current, 3V Supply Voltage .................................................................................. 18
3.4. Typical High-Level Output Current, 3V Supply Voltage ................................................................................. 19
3.5. Typical Low-Level Output Current, 3.8V Supply Voltage ............................................................................... 20
3.6. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................... 21
3.7. Minimum Load Capacitance (C
) Requirement For Safe Crystal Startup ..................................................... 22
LFXOL
3.8. Calibrated LFRCO Frequency vs Temperature and Supply Voltage ................................................................ 24
3.9. Calibrated HFRCO 11 MHz Band Frequency vs Temperature and Supply Voltage ............................................ 25
3.10. Calibrated HFRCO 14 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 25
3.11. Calibrated HFRCO 21 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 25
3.12. Calibrated HFRCO 28 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 26
3.13. Integral Non-Linearity (INL) ................................................................................................................... 30
3.14. Differential Non-Linearity (DNL) .............................................................................................................. 31
3.15. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 32
3.16. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 33
3.17. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25° ................................................................. 34
3.18. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 35
3.19. ADC Dynamic Performance vs Temperature for all ADC References, Vdd = 3V .............................................. 35
3.20. ADC Temperature sensor readout ......................................................................................................... 36
3.21. OPAMP Common Mode Rejection Ratio ................................................................................................. 39
3.22. OPAMP Positive Power Supply Rejection Ratio ........................................................................................ 39
3.23. OPAMP Negative Power Supply Rejection Ratio ...................................................................................... 40
3.24. OPAMP Voltage Noise Spectral Density (Unity Gain) V
=1V ..................................................................... 40
out
3.25. OPAMP Voltage Noise Spectral Density (Non-Unity Gain) .......................................................................... 40
3.26. Typical ACMP Characteristics ............................................................................................................... 42
4.1. EFM32LG995 Pinout (top view, not to scale) .............................................................................................. 46
4.2. Opamp Pinout ...................................................................................................................................... 59
4.3. BGA120 .............................................................................................................................................. 60
5.1. BGA120 PCB Land Pattern ..................................................................................................................... 61
5.2. BGA120 PCB Solder Mask ..................................................................................................................... 62
5.3. BGA120 PCB Stencil Design ................................................................................................................... 63
6.1. Example Chip Marking ........................................................................................................................... 64
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2012-09-11 - EFM32LG995FXX - d0124_Rev1.00
69

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