450-0064R LS Research, 450-0064R Datasheet - Page 28

• Manufacturer Part Number: 450-0064R
• Description: WiFi / 802.11 Modules TiWi-BLE module, TR WLAN, BT, BLE, ANT
• Manufacturer: LS Research

Specifications of 450-0064R

• Rohs: yes
• Protocol Supported: 802.11 b/g/n, Bluetooth
• Frequency Band: 2412 MHz to 2472 MHz
• Data Rate: 65 Mbps
• Interface Type: SDIO
• Transmit Power (max): 12.5 dBm, 14.5 dBm, 20 dBm
• Antenna Connector Type: U.FL
• Operating Supply Voltage: 1.8 V, 3.6 V
• Supply Current Transmitting: 280 mA
• Supply Current Receiving: 100 ma
• Maximum Operating Temperature: + 85 C
• Dimensions: 18 mm x 13 mm x 1.8 mm
• Minimum Operating Temperature: - 40 C
• Factory Pack Quantity: 1000

CLEANING
In general, cleaning the populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the
following:
REWORK
The module can be unsoldered from the host
board if the Moisture Sensitivity Level (MSL)
requirements are met as described in this
datasheet.
The information in this document is subject to change without notice.
330-0087-R1.0
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Never attempt a rework on the
module
individual components. Such actions
will terminate warranty coverage.
Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board and the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shield, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
Ultrasonic cleaning could damage the
module permanently.
Proper alignment and centering of the
module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring
pads, or vias.
itself,
e.g.
Copyright © 2011-2012 LS Research, LLC
replacing
SHIPPING, HANDLING, AND STORAGE
Shipping
Bulk orders of the TiWi-BLE modules are
delivered in trays of 100 or reels of 1,000.
Handling
The TiWi-BLE modules contain a highly
sensitive electronic circuitry. Handling without
proper ESD protection may destroy or damage
the module permanently. ESD protection may
destroy or damage the module permanently.
Moisture Sensitivity Level (MSL)
Per J-STD-020, devices rated as MSL 4 and
not stored in a sealed bag with desiccant pack
should be baked prior to use.
After opening packaging, devices that will be
subjected to reflow must be mounted within 72
hours of factory conditions (<30°C and 60%
RH) or stored at <10% RH.
Bake devices for 48 hours at 125°C.
Storage
Please use this product within 6 months after
receipt. Any product used after 6 months of
receipt needs to have solderability confirmed
before use.
The product shall be stored without opening the
packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be
deformed at the temperatures above this range.)
Do not store in salty air or in an environment
with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
The product should not be subject to excessive
mechanical shock.
TiWi-BLE TRANSCEIVER MODULE
DATASHEET
Page 28 of 36