MAX5702AAUB+ Maxim Integrated, MAX5702AAUB+ Datasheet - Page 2

• Manufacturer Part Number: MAX5702AAUB+
• Description: Digital to Analog Converters - DAC 12-Bit 2Ch DAC w/SPI
• Manufacturer: Maxim Integrated

Specifications of MAX5702AAUB+

• Rohs: yes
• Resolution: 12 bit
• Interface Type: SPI
• Settling Time: 4.5 us
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: uMAX-10
• Maximum Power Dissipation: 707 mW
• Minimum Operating Temperature: - 40 C
• Supply Current: 250 uA
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 1.8 V
• Voltage Reference: 10 PPM / C

Maxim Integrated
ABSOLUTE MAXIMUM RATINgS
V
OUT_, REF to GND....-0.3V to the lower of (V
CSB, SCLK, CLR to GND ........................................ -0.3V to +6V
DIN to GND .................................................-0.3V to the lower of
Continuous Power Dissipation (T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACkAgE THERMAL CHARACTERISTICS (Note 1)
µMAX
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
ELECTRICAL CHARACTERISTICS
(V
values are at T
Ultra-Small, Dual-Channel, 8-/10-/12-Bit Buffered Output
DC PERFORMANCE (Note 3)
Resolution and Monotonicity
Integral Nonlinearity (Note 4)
Differential Nonlinearity (Note 4)
Offset Error (Note 5)
Offset Error Drift
Gain Error (Note 5)
Gain Temperature Coefficient
Zero-Scale Error
Full-Scale Error
DD
DD
µMAX (derate at 8.8mW/NC above 70NC) ....................707mW
TDFN (derate at 24.4mW/NC above 70NC) ................1951mW
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
, V
= 2.7V to 5.5V, V
DDIO
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER
to GND ................................................ -0.3V to +6V
A
= +25NC.) (Note 2)
DACs with Internal Reference and SPI Interface
DDIO
= 1.8V to 5.5V, V
A
= +70NC)
SYMBOL
(V
DNL
INL
OE
GE
N
DDIO
JC
DD
GND
) ...............42NC/W
JA
+ 0.3V) and +6V
+ 0.3V) and +6V
) ........113NC/W
MAX5700
MAX5701
MAX5702
MAX5700
MAX5701
MAX5702
MAX5700
MAX5701
MAX5702
With respect to V
With respect to V
= 0V, C
MAX5700/MAX5701/MAX5702
L
= 200pF, R
CONDITIONS
REF
REF
Maximum Continuous Current into Any Pin .................... Q50mA
Operating Temperature Range ........................ -40NC to +125NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) .................................... +260NC
TDFN
L
= 2kI, T
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
A
= -40NC to +125NC, unless otherwise noted. Typical
-0.25
-0.25
MIN
-0.5
-0.5
-1.0
-0.5
10
12
-1
-1
-5
8
0
Q0.05
Q0.25
Q0.05
Q0. 5
Q0.1
Q0.2
Q0.5
Q0.1
Q3.0
TYP
Q10
JC
+0.25
+0.25
) .................9NC/W
MAX
+0.5
+0.5
+1.0
+0.5
JA
+1
+1
+5
10
) ..........41NC/W
ppm of
UNITS
FV/NC
FS/NC
%FS
%FS
LSB
LSB
Bits
mV
mV
2