CAT24C08WI-GT3JN ON Semiconductor, CAT24C08WI-GT3JN Datasheet - Page 15
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CAT24C08WI-GT3JN
Manufacturer Part Number
CAT24C08WI-GT3JN
Description
EEPROM 8KB I2C SER EEPROM
Manufacturer
ON Semiconductor
Datasheet
1.CAT24C08WI-GT3JN.pdf
(21 pages)
Specifications of CAT24C08WI-GT3JN
Product Category
EEPROM
Rohs
yes
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CAT24C08WI-GT3JN
Manufacturer:
ON Semiconductor
Quantity:
2 050
2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
T
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
D
SEATING
PLANE
5X
0.20
C A B
0.039
PACKAGE DIMENSIONS
1.0
0.037
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 483−02
J
K
ISSUE H
TSOP−5
15
DETAIL Z
0.074
1.9
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
A
B
C
D
G
H
K
M
J
L
S
inches
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_